Hefei SMAT Technology Co., LTD

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Hefei City, CN

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing chip packaging structure with dissipation l...
- Patent number 11,735,503
- Issue date Aug 22, 2023
- HEFEI SMAT TECHNOLOGY CO., LTD.
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packaging structure with heat dissipation layer, flange and se...
- Patent number 11,239,140
- Issue date Feb 1, 2022
- HEFEI SMAT TECHNOLOGY CO., LTD.
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
EXPOSED BONDING PAD OF CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230411261
- Publication date Dec 21, 2023
- Hefei SMAT Technology Co., LTD
- Guangyao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP HEAT DISSIPATING STRUCTURE, PROCESS AND SEMICONDUCTOR DEVICE
- Publication number 20230386959
- Publication date Nov 30, 2023
- HEFEI SMAT TECHNOLOGY CO.,LTD.
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220115299
- Publication date Apr 14, 2022
- Hefei SMAT Technology Co., LTD
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20190189541
- Publication date Jun 20, 2019
- Hefei SMAT Technology Co., LTD
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS

Trademarklast 30 trademarks