HESSE & KNIPPS GMBH

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Paderborn, DE

Organizations

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Patents Grantslast 30 patents

Information Patent Grant
Bonding device, ultrasonic transducer, and bonding method
- Patent number 8,434,659
- Issue date May 7, 2013
- Hesse & Knipps GmbH
- Hans-Juergen Hesse
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrasonic transducer comprising a sensor disposed in the mounting
- Patent number 7,611,039
- Issue date Nov 3, 2009
- Hesse & Knipps GmbH
- Hans-Juergen Hesse
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Camera-assisted adjustment of bonding head elements
- Patent number 7,461,768
- Issue date Dec 9, 2008
- Hesse & Knipps GmbH
- Frank Walther
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of and apparatus for testing a wire bond connection
- Patent number 7,134,591
- Issue date Nov 14, 2006
- Hesse & Knipps GmbH
- Frank Walther
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cruciform ultrasonic transducer
- Patent number 6,995,498
- Issue date Feb 7, 2006
- Hesse & Knipps GmbH
- Jörg Wallaschek
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and components for flip-chip bonding
- Patent number 6,946,745
- Issue date Sep 20, 2005
- Hesse & Knipps GmbH
- Hans Hesse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire brake
- Patent number 6,443,384
- Issue date Sep 3, 2002
- Hesse & Knipps GmbH
- Frank Walther
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Quality control method
- Patent number 6,308,881
- Issue date Oct 30, 2001
- Hesse & Knipps GmbH
- Hans Jürgen Hesse
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

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Patents Applicationslast 30 patents

Information Patent Application
BONDING DEVICE, ULTRASONIC TRANSDUCER, AND BONDING METHOD
- Publication number 20110266329
- Publication date Nov 3, 2011
- HESSE & KNIPPS GMBH
- Hans-Juergen Hesse
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of and apparatus for testing a wire bond connection
- Publication number 20040226983
- Publication date Nov 18, 2004
- HESSE & KNIPPS GmbH
- Frank Walther
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Contact assembly for a rotatable circuit element
- Publication number 20040154824
- Publication date Aug 12, 2004
- HESSE & KNIPPS GmbH
- Hans Hesse
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Cruciform ultrasonic transducer
- Publication number 20030168938
- Publication date Sep 11, 2003
- HESSE & KNIPPS GmbH
- Jorg Wallaschek
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and components for flip-chip bonding
- Publication number 20030151145
- Publication date Aug 14, 2003
- HESSE & KNIPPS GmbH
- Hans Hesse
- H01 - BASIC ELECTRIC ELEMENTS

HESSE & KNIPPS GMBH

Organization

Patents Grantslast 30 patents

Bonding device, ultrasonic transducer, and bonding method

Ultrasonic transducer comprising a sensor disposed in the mounting

Camera-assisted adjustment of bonding head elements

Method of and apparatus for testing a wire bond connection

Cruciform ultrasonic transducer

Method and components for flip-chip bonding

Wire brake

Quality control method

Patents Applicationslast 30 patents

BONDING DEVICE, ULTRASONIC TRANSDUCER, AND BONDING METHOD

Method of and apparatus for testing a wire bond connection

Contact assembly for a rotatable circuit element

Cruciform ultrasonic transducer

Method and components for flip-chip bonding