Hideo HONMA

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Kanagawa-ken, JP

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Patents Applicationslast 30 patents

Information Patent Application
Microporous copper film and electroless copper plating solution for...
- Publication number 20020046679
- Publication date Apr 25, 2002
- Hideo HONMA
- Hideo Honma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...