High Conduction Scientific Co. Ltd.

Organization

Lujhu Township, Taoyuan, TW

Organizations

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Packaging device for an electronic element and method for making th...
- Patent number 8,431,835
- Issue date Apr 30, 2013
- High Conduction Scientific Co. Ltd.
- Wen-Chung Chiang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
Liquid-cooled heat dissipating device and method of making the same
- Publication number 20100307730
- Publication date Dec 9, 2010
- High Conduction Scientific Co., Ltd.
- Wen-Chung Chiang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Circuit board module and method of making the same
- Publication number 20100288537
- Publication date Nov 18, 2010
- High Conduction Scientific Co., Ltd.
- Wen-Chung Chiang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Ceramic circuit board and method of making the same
- Publication number 20100288536
- Publication date Nov 18, 2010
- High Conduction Scientific Co., Ltd.
- Wen-Chung Chiang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGING SUBSTRATE DEVICE, METHOD FOR MAKING THE PACKAGING SUBSTRA...
- Publication number 20100258838
- Publication date Oct 14, 2010
- High Conduction Scientific Co., Ltd.
- Wen-Chung Chiang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MAKING THE SAME
- Publication number 20100236819
- Publication date Sep 23, 2010
- High Conduction Scientific Co., Ltd.
- Wen-Chung Chiang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGING DEVICE FOR AN ELECTRONIC ELEMENT AND METHOD FOR MAKING TH...
- Publication number 20100230156
- Publication date Sep 16, 2010
- High Conduction Scientific Co., Ltd.
- Wen-Chung Chiang
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Ceramic-Copper Foil Bonding Method
- Publication number 20090152237
- Publication date Jun 18, 2009
- High Conduction Scientific Co., Ltd.
- Wen-Chung Chiang
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES

High Conduction Scientific Co. Ltd.

Organization

Patents Grantslast 30 patents

Packaging device for an electronic element and method for making th...

Patents Applicationslast 30 patents

Liquid-cooled heat dissipating device and method of making the same

Circuit board module and method of making the same

Ceramic circuit board and method of making the same

PACKAGING SUBSTRATE DEVICE, METHOD FOR MAKING THE PACKAGING SUBSTRA...

PRINTED CIRCUIT BOARD AND METHOD FOR MAKING THE SAME

PACKAGING DEVICE FOR AN ELECTRONIC ELEMENT AND METHOD FOR MAKING TH...

Ceramic-Copper Foil Bonding Method

Trademarklast 30 trademarks