High Connection Density, Inc.

Follow

Organization

Ithaca, NY, US

Organizations

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Wire segment based interposer for high frequency electrical connection
- Patent number 6,264,476
- Issue date Jul 24, 2001
- High Connection Density, Inc.
- Che-yu Li
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Trademarklast 30 trademarks