HONG KONG APPLIED SCIENCE AND

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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

Information Patent Application
Stacked multi-chip package with EMI shielding
- Publication number 20080067656
- Publication date Mar 20, 2008
- Hong Kong Applied Science
- Lap Wai Leung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for reducing bit rate requirements for encoding multimedia data
- Publication number 20060176961
- Publication date Aug 10, 2006
- Hong Kong Applied Science and
- Yan Huo
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Method and system for determining symbol boundary timing in a multi...
- Publication number 20050276340
- Publication date Dec 15, 2005
- Hong Kong Applied Science
- Jacky S. Chow
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Trademarklast 30 trademarks