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Hong Kong Applied Science Technology Research Institute Company Limited
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Shatin, New Territories, HK
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Patents Grants
last 30 patents
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Patent Grant
Stacked multi-chip package with EMI shielding
Patent number
7,514,774
Issue date
Apr 7, 2009
Hong Kong Applied Science Technology Research Institute Company Limited
Lap Wai Leung
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
Optical sensing methods and apparatus
Publication number
20080239325
Publication date
Oct 2, 2008
Hong Kong Applied Science Technology Research Institute Co. Ltd.
Kwok Sing Cheng
G01 - MEASURING TESTING
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last 30 trademarks