Hong Kong Applied Science Technology Research Institute Company Limited

Organization

  • Shatin, New Territories, HK

Patents Grantslast 30 patents

  • Information Patent Grant

    Stacked multi-chip package with EMI shielding

    • Patent number 7,514,774
    • Issue date Apr 7, 2009
    • Hong Kong Applied Science Technology Research Institute Company Limited
    • Lap Wai Leung
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    Optical sensing methods and apparatus

    • Publication number 20080239325
    • Publication date Oct 2, 2008
    • Hong Kong Applied Science Technology Research Institute Co. Ltd.
    • Kwok Sing Cheng
    • G01 - MEASURING TESTING

Trademarklast 30 trademarks