HUATIAN TECHNOLOGY (KUNSHAN) ELECTRONICS CO., LTD.

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Kunshan, CN

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Patents Grantslast 30 patents

Information Patent Grant
Embedded silicon substrate fan-out type 3D packaging structure
- Patent number 10,559,525
- Issue date Feb 11, 2020
- HUATIAN TECHNOLOGY (KUNSHAN) ELECTRONICS CO., LTD.
- Daquan Yu
- H01 - BASIC ELECTRIC ELEMENTS

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Patents Applicationslast 30 patents

Information Patent Application
SYSTEM-ON-CHIP INTEGRATED PACKAGING STRUCTURE, MANUFACTURING METHOD...
- Publication number 20230022427
- Publication date Jan 26, 2023
- HUATIAN TECHNOLOGY (KUNSHAN) ELECTRONICS CO., LTD.
- Shuying MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED SILICON SUBSTRATE FAN-OUT TYPE 3D PACKAGING STRUCTURE
- Publication number 20180366403
- Publication date Dec 20, 2018
- HUATIAN TECHNOLOGY (KUNSHAN) ELECTRONICS CO., LTD.
- Daquan YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED SILICON SUBSTRATE FAN-OUT TYPE PACKAGING STRUCTURE AND MAN...
- Publication number 20180182727
- Publication date Jun 28, 2018
- HUATIAN TECHNOLOGY (KUNSHAN) ELECTRONICS CO., LTD.
- Daquan YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGING STRUCTURE OF HIGH-PIXEL IMAGE SENSOR CHIP
- Publication number 20180138221
- Publication date May 17, 2018
- HUATIAN TECHNOLOGY (KUNSHAN) ELECTRONICS CO., LTD.
- Lixi WAN
- H01 - BASIC ELECTRIC ELEMENTS