HUATIAN TECHNOLOGY (XI'AN) CO., LTD.

Follow

Organization

Xi'an, CN

Organizations

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Dense-pitch small-pad copper wire bonded double IC chip stack packa...
- Patent number 9,312,242
- Issue date Apr 12, 2016
- TIANSHUI HUATIAN TECHNOLOGY CO., LTD.
- Wei Mu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quad flat no lead package and production method thereof
- Patent number 9,275,941
- Issue date Mar 1, 2016
- TIANSHUI HUATIAN TECHNOLOGY CO.
- Wenhui Zhu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
QUAD FLAT NO LEAD PACKAGE AND PRODUCTION METHOD THEREOF
- Publication number 20150102476
- Publication date Apr 16, 2015
- HUATIAN TECHNOLOGY (XI'AN) CO., LTD.
- Wenhui Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DENSE-PITCH SMALL-PAD COPPER WIRE BONDED DOUBLE IC CHIP STACK PACKA...
- Publication number 20150061099
- Publication date Mar 5, 2015
- TIANSHUI HUATIAN TECHNOLOGY CO., LTD
- Wei Mu
- H01 - BASIC ELECTRIC ELEMENTS

Trademarklast 30 trademarks