HUZHOU JIANWENLU TECHNOLOGY CO., LTD.

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Huzhou, CN

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Patents Grantslast 30 patents

Information Patent Grant
EMI shielding material, EMI shielding process, and communication mo...
- Patent number 11,770,920
- Issue date Sep 26, 2023
- HUZHOU JIANWENLU TECHNOLOGY CO., LTD.
- Linping Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip packaging method and chip packaging structure
- Patent number 11,552,028
- Issue date Jan 10, 2023
- HUZHOU JIANWENLU TECHNOLOGY CO., LTD.
- Linping Li
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
EMI SHIELDING MATERIAL, EMI SHIELDING PROCESS, AND COMMUNICATION MO...
- Publication number 20220418174
- Publication date Dec 29, 2022
- HUZHOU JIANWENLU TECHNOLOGY CO., LTD.
- Linping LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP PACKAGING METHOD AND CHIP PACKAGING STRUCTURE
- Publication number 20220181269
- Publication date Jun 9, 2022
- HUZHOU JIANWENLU TECHNOLOGY CO., LTD.
- Linping LI
- H01 - BASIC ELECTRIC ELEMENTS

Trademarklast 30 trademarks