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I3 ELECTRONICS, INC
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ENDICOTT, NY, US
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Patents Grants
last 30 patents
Information
Patent Grant
Method of making a circuitized substrate
Patent number
9,756,724
Issue date
Sep 5, 2017
i3 ELECTRONICS, INC.
Rabindra N. Das
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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Patent Grant
Electrically conductive adhesive (ECA) for multilayer device interc...
Patent number
9,451,693
Issue date
Sep 20, 2016
i3 ELECTRONICS, INC.
Rabindra N. Das
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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Patent Grant
Method of making a circuitized substrate
Patent number
9,420,689
Issue date
Aug 16, 2016
i3 Electronics, Inc.
Rabindra N. Das
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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Patent Grant
Coreless layer buildup structure with LGA and joining layer
Patent number
9,351,408
Issue date
May 24, 2016
i3 ELECTRONICS, INC.
Voya Markovich
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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Patents Applications
last 30 patents
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Patent Application
Structure and Method of Making Circuitized Substrate Assembly
Publication number
20180156841
Publication date
Jun 7, 2018
i3 Electronics, Inc.
Matthew D. Neely
H01 - BASIC ELECTRIC ELEMENTS