TREA

IBIS INNOTECH INC.

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Organization

  • Taichung City, TW
Organizations

Patents Grantslast 30 patents

  • Information Patent Grant

    Package structure and manufacturing method of package structure
    • Patent number 10,256,180
    • Issue date Apr 9, 2019
    • IBIS Innotech Inc.
    • Wen-Chun Liu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Package structure
    • Patent number 10,134,668
    • Issue date Nov 20, 2018
    • IBIS Innotech Inc.
    • Wen-Chun Liu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor structure
    • Patent number 10,090,256
    • Issue date Oct 2, 2018
    • IBIS Innotech Inc.
    • Wen-Chun Liu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Package structure
    • Patent number 9,859,193
    • Issue date Jan 2, 2018
    • IBIS Innotech Inc.
    • Wen-Chun Liu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Package structure
    • Patent number 9,801,282
    • Issue date Oct 24, 2017
    • IBIS Innotech Inc.
    • Wen-Chun Liu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Package structure
    • Patent number 9,508,634
    • Issue date Nov 29, 2016
    • IBIS Innotech Inc.
    • Wen-Chun Liu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Package substrate structure
    • Patent number 9,451,694
    • Issue date Sep 20, 2016
    • IBIS Innotech Inc.
    • Chih-Kung Huang
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Electrical connector and backlight module using the same
    • Patent number 8,985,807
    • Issue date Mar 24, 2015
    • IBIS Innotech Inc.
    • Chen Hui-Hsiung
    • F21 - LIGHTING

Patents Applicationslast 30 patents

  • Information Patent Application

    PACKAGE STRUCTURE
    • Publication number 20180294218
    • Publication date Oct 11, 2018
    • IBIS INNOTECH INC.
    • Wen-Chun Liu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE STRUCTURE
    • Publication number 20170256479
    • Publication date Sep 7, 2017
    • IBIS INNOTECH INC.
    • Wen-Chun Liu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE STRUCTURE AND MANUFACTURING METHOD OF PACKAGE STRUCTURE
    • Publication number 20170194241
    • Publication date Jul 6, 2017
    • IBIS INNOTECH INC.
    • Wen-Chun Liu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR STRUCTURE
    • Publication number 20170077045
    • Publication date Mar 16, 2017
    • IBIS INNOTECH INC.
    • Wen-Chun Liu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE STRUCTURE
    • Publication number 20160353575
    • Publication date Dec 1, 2016
    • IBIS INNOTECH INC.
    • Wen-Chun Liu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PACKAGE STRUCTURE
    • Publication number 20160233152
    • Publication date Aug 11, 2016
    • IBIS INNOTECH INC.
    • Wen-Chun Liu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    TOUCH SENSING DEVICE
    • Publication number 20160034083
    • Publication date Feb 4, 2016
    • IBIS INNOTECH INC.
    • Wei-Jen LAI
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    PACKAGE SUBSTRATE STRUCTURE
    • Publication number 20150373849
    • Publication date Dec 24, 2015
    • IBIS INNOTECH INC.
    • Chih-Kung Huang
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PACKAGE STRUCTURE
    • Publication number 20150364448
    • Publication date Dec 17, 2015
    • IBIS INNOTECH INC.
    • Chih-Kung Huang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FERRITE CIRCUIT BOARD
    • Publication number 20150061814
    • Publication date Mar 5, 2015
    • IBIS INNOTECH INC.
    • Wei-Jen LAI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CERAMIC CIRCUIT BOARD AND LED PACKAGE MODULE USING THE SAME
    • Publication number 20150060929
    • Publication date Mar 5, 2015
    • IBIS INNOTECH INC.
    • Wei-Jen LAI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF MAKING LIGHT-GUIDING MODULE
    • Publication number 20100301504
    • Publication date Dec 2, 2010
    • IBIS INNOTECH INC.
    • Cheng-Yang Hsieh
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Trademarklast 30 trademarks

  • Information Trademark

    77828716 - IBIS PICOINK
    • Serial number 77828716
    • Registration number 4010815
    • Filing date Sep 17, 2009
    • IBIS INNOTECH INC.
    • 2 - Paints, varnishes, lacquers