Indium Corporation

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New Hartford, NY, US

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Patents Grantslast 30 patents

Information Patent Grant
High reliability lead-free solder alloys for harsh environment elec...
- Patent number 12,090,579
- Issue date Sep 17, 2024
- Indium Corporation
- Weiping Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermally decomposing build plate with casting mold for facile rele...
- Patent number 12,042,864
- Issue date Jul 23, 2024
- Indium Corporation
- David P. Socha
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Thermally decomposable build plate structure for stabilization of m...
- Patent number 12,023,735
- Issue date Jul 2, 2024
- Indium Corporation
- David P. Socha
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
SnBi and SnIn solder alloys
- Patent number 11,999,018
- Issue date Jun 4, 2024
- Indium Corporation
- Francis M. Mutuku
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for preparing graphite sheets with piercing treatment to enh...
- Patent number 11,807,536
- Issue date Nov 7, 2023
- Indium Corporation
- Hongtao Xia
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Thermally decomposing build plate for facile release of 3D printed...
- Patent number 11,766,721
- Issue date Sep 26, 2023
- Indium Corporation
- David P. Socha
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
High reliability leadfree solder alloys for harsh service conditions
- Patent number 11,752,579
- Issue date Sep 12, 2023
- Indium Corporation
- Jie Geng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free solder paste with mixed solder powders for high temperatu...
- Patent number 11,738,411
- Issue date Aug 29, 2023
- Indium Corporation
- Hongwen Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low temperature melting and mid temperature melting lead-free solde...
- Patent number 11,712,762
- Issue date Aug 1, 2023
- Indium Corporation
- Hongwen Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder preform with internal flux core including thermochromic indi...
- Patent number 11,602,808
- Issue date Mar 14, 2023
- Indium Corporation
- Craig K. Merritt
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free solder paste as thermal interface material
- Patent number 11,581,239
- Issue date Feb 14, 2023
- Indium Corporation
- Ning-Cheng Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High reliability lead-free solder alloys for harsh environment elec...
- Patent number 11,413,709
- Issue date Aug 16, 2022
- Indium Corporation
- Weiping Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low temperature melting and mid temperature melting lead-free solde...
- Patent number 11,267,080
- Issue date Mar 8, 2022
- Indium Corporation
- Hongwen Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High reliability lead-free solder alloys for harsh environment elec...
- Patent number 11,229,979
- Issue date Jan 25, 2022
- Indium Corporation
- Weiping Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device assembly having a thermal interface bond betwe...
- Patent number 10,943,796
- Issue date Mar 9, 2021
- Indium Corporation
- Ross B. Berntson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for creating a thermal interface bond between...
- Patent number 10,943,795
- Issue date Mar 9, 2021
- Indium Corporation
- Ross B. Berntson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid high temperature lead-free solder preform
- Patent number 10,888,958
- Issue date Jan 12, 2021
- Indium Corporation
- Hongwen Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Burn-in preform and method of making the same
- Patent number 10,838,002
- Issue date Nov 17, 2020
- Indium Corporation
- Thomas R. Gross
- G01 - MEASURING TESTING
Information Patent Grant
Preventing post reflow interconnect failures in VIPPO solder joints...
- Patent number 10,813,228
- Issue date Oct 20, 2020
- Indium Corporation
- Lee C. Kresge
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fluxes effective in suppressing non-wet-open at BGA assembly
- Patent number 10,756,039
- Issue date Aug 25, 2020
- Indium Corporation
- Fengying Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly including a thermal interface bond be...
- Patent number 10,607,857
- Issue date Mar 31, 2020
- Indium Corporation
- Ross B. Berntson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Voiding control using solid solder preforms embedded in solder paste
- Patent number 10,537,030
- Issue date Jan 14, 2020
- Indium Corporation
- Zhenxi Wei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid lead-free solder wire
- Patent number 10,328,533
- Issue date Jun 25, 2019
- Indium Corporation
- Hongwen Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mixed alloy solder paste
- Patent number 10,118,260
- Issue date Nov 6, 2018
- Indium Corporation
- Hongwen Zhang
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Materials having increased mobility after heating
- Patent number 10,010,981
- Issue date Jul 3, 2018
- Indium Corporation
- Ning-Cheng Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Nanomicrocrystallite paste for pressureless sintering
- Patent number 9,875,983
- Issue date Jan 23, 2018
- Indium Corporation
- Sihai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid lead-free solder wire
- Patent number 9,802,274
- Issue date Oct 31, 2017
- Indium Corporation
- Hongwen Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tin-indium based low temperature solder alloy
- Patent number 9,741,676
- Issue date Aug 22, 2017
- Indium Corporation
- Jianguo Luo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mixed alloy solder paste
- Patent number 9,636,784
- Issue date May 2, 2017
- Indium Corporation
- Hongwen Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low void solder joint for multiple reflow applications
- Patent number 9,468,136
- Issue date Oct 11, 2016
- Indium Corporation
- Jordan Peter Ross
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
THERMALLY DECOMPOSABLE BUILD PLATE STRUCTURE FOR STABILIZATION OF M...
- Publication number 20240326133
- Publication date Oct 3, 2024
- Indium Corporation
- David P. Socha
- B22 - CASTING POWDER METALLURGY
Information Patent Application
THERMALLY DECOMPOSING BUILD PLATE FOR FACILE RELEASE OF 3D PRINTED...
- Publication number 20230405677
- Publication date Dec 21, 2023
- Indium Corporation
- David P. Socha
- B22 - CASTING POWDER METALLURGY
Information Patent Application
THERMALLY DECOMPOSABLE BUILD PLATE STRUCTURE FOR STABILIZATION OF M...
- Publication number 20230302541
- Publication date Sep 28, 2023
- Indium Corporation
- David P. Socha
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SOLDER PREFORM WITH INTERNAL FLUX CORE INCLUDING THERMOCHROMIC INDI...
- Publication number 20230191541
- Publication date Jun 22, 2023
- Indium Corporation
- Craig K. Merritt
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID METAL PASTE CONTAINING METAL PARTICLE ADDITIVE
- Publication number 20230197558
- Publication date Jun 22, 2023
- Indium Corporation
- Guangyu Fan
- B22 - CASTING POWDER METALLURGY
Information Patent Application
LIQUID METAL COMPOSITES CONTAINING ORGANIC ADDITIVE AS THERMAL INTE...
- Publication number 20230142030
- Publication date May 11, 2023
- Indium Corporation
- Guangyu Fan
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
METHOD FOR PREPARING GRAPHITE SHEETS WITH PIERCING TREATMENT TO ENH...
- Publication number 20230033918
- Publication date Feb 2, 2023
- Indium Corporation
- Hongtao Xia
- C01 - INORGANIC CHEMISTRY
Information Patent Application
HIGH RELIABILITY LEAD-FREE SOLDER PASTES WITH MIXED SOLDER ALLOY PO...
- Publication number 20220395936
- Publication date Dec 15, 2022
- Indium Corporation
- Jie Geng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLID METAL FOAM THERMAL INTERFACE MATERIAL
- Publication number 20220375816
- Publication date Nov 24, 2022
- Indium Corporation
- Ross B. Berntson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL THERMAL INTERFACE
- Publication number 20220375817
- Publication date Nov 24, 2022
- Indium Corporation
- Ross B. Berntson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SNIN SOLDER ALLOYS
- Publication number 20220362890
- Publication date Nov 17, 2022
- Indium Corporation
- Francis M. Mutuku
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH RELIABILITY LEAD-FREE SOLDER ALLOYS FOR HARSH ENVIRONMENT ELEC...
- Publication number 20220331913
- Publication date Oct 20, 2022
- Indium Corporation
- Weiping Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMALLY DECOMPOSING BUILD PLATE WITH CASTING MOLD FOR FACILE RELE...
- Publication number 20220266343
- Publication date Aug 25, 2022
- Indium Corporation
- David P. Socha
- B22 - CASTING POWDER METALLURGY
Information Patent Application
BUILD PLATE WITH THERMALLY DECOMPOSING TOP SURFACE FOR FACILE RELEA...
- Publication number 20220266344
- Publication date Aug 25, 2022
- Indium Corporation
- David P. Socha
- B22 - CASTING POWDER METALLURGY
Information Patent Application
LOW TEMPERATURE MELTING AND MID TEMPERATURE MELTING LEAD-FREE SOLDE...
- Publication number 20220184749
- Publication date Jun 16, 2022
- Indium Corporation
- Hongwen Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEAD-FREE SOLDER PASTE WITH MIXED SOLDER POWDERS FOR HIGH TEMPERATU...
- Publication number 20210339344
- Publication date Nov 4, 2021
- Indium Corporation
- Hongwen Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMALLY DECOMPOSING BUILD PLATE FOR FACILE RELEASE OF 3D PRINTED...
- Publication number 20210053122
- Publication date Feb 25, 2021
- Indium Corporation
- David P. Socha
- B22 - CASTING POWDER METALLURGY
Information Patent Application
GE-DOPED AUSN SOLDER ALLOYS
- Publication number 20210047710
- Publication date Feb 18, 2021
- Indium Corporation
- Joseph C. Wu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW TEMPERATURE MELTING AND MID TEMPERATURE MELTING LEAD-FREE SOLDE...
- Publication number 20200353572
- Publication date Nov 12, 2020
- Indium Corporation
- Hongwen Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER PREFORM WITH INTERNAL FLUX CORE INCLUDING THERMOCHROMIC INDI...
- Publication number 20200346307
- Publication date Nov 5, 2020
- Indium Corporation
- Craig K. Merritt
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH RELIABILITY LEADFREE SOLDER ALLOYS FOR HARSH SERVICE CONDITIONS
- Publication number 20200269360
- Publication date Aug 27, 2020
- Indium Corporation
- Jie Geng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEAD-FREE SOLDER PASTE FOR THERMAL VIA FILLING
- Publication number 20200230750
- Publication date Jul 23, 2020
- Indium Corporation
- Ning-Cheng Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEAD-FREE SOLDER PASTE AS THERMAL INTERFACE MATERIAL
- Publication number 20200235033
- Publication date Jul 23, 2020
- Indium Corporation
- Ning-Cheng Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHODS FOR CREATING A THERMAL INTERFACE BOND BETWEEN...
- Publication number 20200126813
- Publication date Apr 23, 2020
- Indium Corporation
- ROSS B. BERNTSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH RELIABILITY LEAD-FREE SOLDER ALLOYS FOR HARSH ENVIRONMENT ELEC...
- Publication number 20200094353
- Publication date Mar 26, 2020
- Indium Corporation
- Weiping Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SNBI AND SNIN SOLDER ALLOYS
- Publication number 20200070287
- Publication date Mar 5, 2020
- Indium Corporation
- Francis M. Mutuku
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PREVENTING POST REFLOW INTERCONNECT FAILURES IN VIPPO SOLDER JOINTS...
- Publication number 20190394883
- Publication date Dec 26, 2019
- Indium Corporation
- Lee C. Kresge
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HYBRID HIGH TEMPERATURE LEAD-FREE SOLDER PREFORM
- Publication number 20190366486
- Publication date Dec 5, 2019
- Indium Corporation
- HONGWEN ZHANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLUXES EFFECTIVE IN SUPPRESSING NON-WET-OPEN AT BGA ASSEMBLY
- Publication number 20190371752
- Publication date Dec 5, 2019
- Indium Corporation
- FENGYING ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR CREATING A THERMAL INTERFACE BOND BETWEEN...
- Publication number 20190172727
- Publication date Jun 6, 2019
- Indium Corporation
- ROSS B. BERNTSON
- H01 - BASIC ELECTRIC ELEMENTS

Indium Corporation

Organization

Patents Grantslast 30 patents

High reliability lead-free solder alloys for harsh environment elec...

Thermally decomposing build plate with casting mold for facile rele...

Thermally decomposable build plate structure for stabilization of m...

SnBi and SnIn solder alloys

Method for preparing graphite sheets with piercing treatment to enh...

Thermally decomposing build plate for facile release of 3D printed...

High reliability leadfree solder alloys for harsh service conditions

Lead-free solder paste with mixed solder powders for high temperatu...

Low temperature melting and mid temperature melting lead-free solde...

Solder preform with internal flux core including thermochromic indi...

Lead-free solder paste as thermal interface material

High reliability lead-free solder alloys for harsh environment elec...

Low temperature melting and mid temperature melting lead-free solde...

High reliability lead-free solder alloys for harsh environment elec...

Semiconductor device assembly having a thermal interface bond betwe...

Apparatus and methods for creating a thermal interface bond between...

Hybrid high temperature lead-free solder preform

Burn-in preform and method of making the same

Preventing post reflow interconnect failures in VIPPO solder joints...

Fluxes effective in suppressing non-wet-open at BGA assembly

Semiconductor device assembly including a thermal interface bond be...

Voiding control using solid solder preforms embedded in solder paste

Hybrid lead-free solder wire

Mixed alloy solder paste

Materials having increased mobility after heating

Nanomicrocrystallite paste for pressureless sintering

Hybrid lead-free solder wire

Tin-indium based low temperature solder alloy

Mixed alloy solder paste

Low void solder joint for multiple reflow applications

Patents Applicationslast 30 patents

THERMALLY DECOMPOSABLE BUILD PLATE STRUCTURE FOR STABILIZATION OF M...

THERMALLY DECOMPOSING BUILD PLATE FOR FACILE RELEASE OF 3D PRINTED...

THERMALLY DECOMPOSABLE BUILD PLATE STRUCTURE FOR STABILIZATION OF M...

SOLDER PREFORM WITH INTERNAL FLUX CORE INCLUDING THERMOCHROMIC INDI...

LIQUID METAL PASTE CONTAINING METAL PARTICLE ADDITIVE

LIQUID METAL COMPOSITES CONTAINING ORGANIC ADDITIVE AS THERMAL INTE...

METHOD FOR PREPARING GRAPHITE SHEETS WITH PIERCING TREATMENT TO ENH...

HIGH RELIABILITY LEAD-FREE SOLDER PASTES WITH MIXED SOLDER ALLOY PO...

SOLID METAL FOAM THERMAL INTERFACE MATERIAL

LIQUID METAL THERMAL INTERFACE

SNIN SOLDER ALLOYS

HIGH RELIABILITY LEAD-FREE SOLDER ALLOYS FOR HARSH ENVIRONMENT ELEC...

THERMALLY DECOMPOSING BUILD PLATE WITH CASTING MOLD FOR FACILE RELE...

BUILD PLATE WITH THERMALLY DECOMPOSING TOP SURFACE FOR FACILE RELEA...

LOW TEMPERATURE MELTING AND MID TEMPERATURE MELTING LEAD-FREE SOLDE...

LEAD-FREE SOLDER PASTE WITH MIXED SOLDER POWDERS FOR HIGH TEMPERATU...

THERMALLY DECOMPOSING BUILD PLATE FOR FACILE RELEASE OF 3D PRINTED...

GE-DOPED AUSN SOLDER ALLOYS

LOW TEMPERATURE MELTING AND MID TEMPERATURE MELTING LEAD-FREE SOLDE...

SOLDER PREFORM WITH INTERNAL FLUX CORE INCLUDING THERMOCHROMIC INDI...

HIGH RELIABILITY LEADFREE SOLDER ALLOYS FOR HARSH SERVICE CONDITIONS

LEAD-FREE SOLDER PASTE FOR THERMAL VIA FILLING

LEAD-FREE SOLDER PASTE AS THERMAL INTERFACE MATERIAL

APPARATUS AND METHODS FOR CREATING A THERMAL INTERFACE BOND BETWEEN...

HIGH RELIABILITY LEAD-FREE SOLDER ALLOYS FOR HARSH ENVIRONMENT ELEC...

SNBI AND SNIN SOLDER ALLOYS

PREVENTING POST REFLOW INTERCONNECT FAILURES IN VIPPO SOLDER JOINTS...

HYBRID HIGH TEMPERATURE LEAD-FREE SOLDER PREFORM

FLUXES EFFECTIVE IN SUPPRESSING NON-WET-OPEN AT BGA ASSEMBLY

APPARATUS AND METHODS FOR CREATING A THERMAL INTERFACE BOND BETWEEN...

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