INNOPAD, INC.

Organization

Peabody, MA, US

Business Address
265 BALLARDVALE STREET UNIT 2 WILMINGTON MA 01887 978-253-4204
Mailing Address
265 BALLARDVALE STREET UNIT 2 WILMINGTON MA 01887
State Location
MA
State of Incorporation
DE

Organizations

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Patents Grantslast 30 patents

Information Patent Grant
Fabric containing non-crimped fibers and methods of manufacture
- Patent number 8,546,260
- Issue date Oct 1, 2013
- Innopad, Inc.
- Oscar K. Hsu
- B24 - GRINDING POLISHING
Information Patent Grant
Three-dimensional network in CMP pad
- Patent number 8,491,360
- Issue date Jul 23, 2013
- Innopad, Inc.
- Paul Lefevre
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical-mechanical planarization pad including patterned structura...
- Patent number 8,435,099
- Issue date May 7, 2013
- Innopad, Inc.
- Paul Lefevre
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical-mechanical planarization pad
- Patent number 8,430,721
- Issue date Apr 30, 2013
- Innopad, Inc.
- Oscar K. Hsu
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad with controlled void formation
- Patent number 8,377,351
- Issue date Feb 19, 2013
- Innopad, Inc.
- Paul Lefevre
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical-mechanical planarization pad
- Patent number 8,172,648
- Issue date May 8, 2012
- Innopad, Inc.
- Paul Lefevre
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad having micro-grooves on the pad surface
- Patent number 8,137,166
- Issue date Mar 20, 2012
- Innopad, Inc.
- Oscar K. Hsu
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical-mechanical planarization pad having end point detection wi...
- Patent number 7,985,121
- Issue date Jul 26, 2011
- innoPad, Inc.
- Paul Lefevre
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad
- Patent number 7,534,163
- Issue date May 19, 2009
- innoPad, Inc.
- Jean Vangsness
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad
- Patent number 7,357,704
- Issue date Apr 15, 2008
- innoPad, Inc.
- Jean Vangsness
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING A CHEMICAL MECHANICAL PLANARIZATION PAD
- Publication number 20130205679
- Publication date Aug 15, 2013
- INNOPAD, INC.
- John Erik ALDEBORGH
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING PAD HAVING MICRO-GROOVES ON THE PAD SURFACE
- Publication number 20120178348
- Publication date Jul 12, 2012
- INNOPAD, INC.
- Oscar K. HSU
- B24 - GRINDING POLISHING
Information Patent Application
METHOD OF GROOVING A CHEMICAL-MECHANICAL PLANARIZATION PAD
- Publication number 20120073210
- Publication date Mar 29, 2012
- INNOPAD, INC.
- Paul LEFEVRE
- B24 - GRINDING POLISHING
Information Patent Application
FABRIC CONTAINING NON-CRIMPED FIBERS AND METHODS OF MANUFACTURE
- Publication number 20110171831
- Publication date Jul 14, 2011
- INNOPAD, INC.
- Oscar K. Hsu
- D04 - BRAIDING LACE-MAKING KNITTING TRIMMINGS NON-WOVEN FABRICS
Information Patent Application
MULTI-LAYERED CHEMICAL-MECHANICAL PLANARIZATION PAD
- Publication number 20100221983
- Publication date Sep 2, 2010
- INNOPAD, INC.
- Paul LEFEVRE
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL-MECHANICAL PLANARIZATION PAD INCLUDING PATTERNED STRUCTURA...
- Publication number 20100221985
- Publication date Sep 2, 2010
- INNOPAD, INC.
- Paul LEFEVRE
- B24 - GRINDING POLISHING
Information Patent Application
Chemical Mechanical Planarization Pad With Void Network
- Publication number 20090258588
- Publication date Oct 15, 2009
- INNOPAD, INC.
- Oscar K. HSU
- B24 - GRINDING POLISHING
Information Patent Application
Polishing Pad With Controlled Void Formation
- Publication number 20090246504
- Publication date Oct 1, 2009
- INNOPAD, INC.
- Paul LEFEVRE
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL-MECHANICAL PLANARIZATION PAD
- Publication number 20090170410
- Publication date Jul 2, 2009
- INNOPAD, INC.
- Oscar K. HSU
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL-MECHANICAL PLANARIZATION PAD
- Publication number 20090170413
- Publication date Jul 2, 2009
- INNOPAD, INC.
- Oscar K. HSU
- B24 - GRINDING POLISHING
Information Patent Application
Chemical-Mechanical Planarization Pad Having End Point Detection Wi...
- Publication number 20090142989
- Publication date Jun 4, 2009
- INNOPAD, INC.
- Paul Lefevre
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Three-Dimensional Network in CMP Pad
- Publication number 20090137121
- Publication date May 28, 2009
- INNOPAD, INC.
- Oscar K. HSU
- B24 - GRINDING POLISHING
Information Patent Application
Polishing Pad Having Micro-Grooves On The Pad Surface
- Publication number 20080085661
- Publication date Apr 10, 2008
- INNOPAD, INC.
- Oscar K. HSU
- B24 - GRINDING POLISHING

INNOPAD, INC.

Organization

Business Address

Mailing Address

State Location

State of Incorporation

Patents Grantslast 30 patents

Fabric containing non-crimped fibers and methods of manufacture

Three-dimensional network in CMP pad

Chemical-mechanical planarization pad including patterned structura...

Chemical-mechanical planarization pad

Polishing pad with controlled void formation

Chemical-mechanical planarization pad

Polishing pad having micro-grooves on the pad surface

Chemical-mechanical planarization pad having end point detection wi...

Polishing pad

Polishing pad

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING A CHEMICAL MECHANICAL PLANARIZATION PAD

POLISHING PAD HAVING MICRO-GROOVES ON THE PAD SURFACE

METHOD OF GROOVING A CHEMICAL-MECHANICAL PLANARIZATION PAD

FABRIC CONTAINING NON-CRIMPED FIBERS AND METHODS OF MANUFACTURE

MULTI-LAYERED CHEMICAL-MECHANICAL PLANARIZATION PAD

CHEMICAL-MECHANICAL PLANARIZATION PAD INCLUDING PATTERNED STRUCTURA...

Chemical Mechanical Planarization Pad With Void Network

Polishing Pad With Controlled Void Formation

CHEMICAL-MECHANICAL PLANARIZATION PAD

CHEMICAL-MECHANICAL PLANARIZATION PAD

Chemical-Mechanical Planarization Pad Having End Point Detection Wi...

Three-Dimensional Network in CMP Pad

Polishing Pad Having Micro-Grooves On The Pad Surface

Trademarklast 30 trademarks