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International Packaging and Assembly Corporation
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San Jose, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Bent tip method for preventing vertical motion of heat spreaders du...
Patent number
5,872,395
Issue date
Feb 16, 1999
International Packaging and Assembly Corporation
George Fujimoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus for encapsulating IC packages with diamond substrate ther...
Patent number
5,859,477
Issue date
Jan 12, 1999
International Packaging and Assembly Corporation
Gerald K. Fehr
H01 - BASIC ELECTRIC ELEMENTS