International Semiconductor Technology Ltd.

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Kaohsiung, TW

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Patents Applicationslast 30 patents

Information Patent Application
Method for packaging submount adhering light emitting diode and pac...
- Publication number 20090152568
- Publication date Jun 18, 2009
- International Semiconductor Technology Ltd.
- Jian-An Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sliding type thin fingerprint sensor package
- Publication number 20090103787
- Publication date Apr 23, 2009
- International Semiconductor Technology Ltd.
- Yeh-Shun Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Package, packaging method and substrate thereof for sliding type th...
- Publication number 20090073632
- Publication date Mar 19, 2009
- International Semiconductor Technology Ltd.
- Charles Yang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Chip-on-film package for image sensor and method for manufacturing...
- Publication number 20050104186
- Publication date May 19, 2005
- International Semiconductor Technology Ltd.
- Charles Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thin type camera module
- Publication number 20040056971
- Publication date Mar 25, 2004
- International Semiconductor Technology Ltd.
- Charles Yang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE