Ishii Tool & Engineering Corp.

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Ohita, JP

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Patents Grantslast 30 patents

Information Patent Grant
IC leadframe processing system
- Patent number 5,956,838
- Issue date Sep 28, 1999
- Ishii Tool & Engineering Corp.
- Mitoshi Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead bending machine for electronic components
- Patent number 5,860,455
- Issue date Jan 19, 1999
- Ishii Tool & Engineering Corp.
- Mitoshi Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of centering integrated circuit lead frame
- Patent number 5,657,538
- Issue date Aug 19, 1997
- Ishii Tool & Engineering Corpn.
- Mitoshi Ishii
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR