ITEQ (DONGGUAN) CORPORATION

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Dongguan City, CN

Organizations

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Patents Grantslast 30 patents

Information Patent Grant
Resin composition, prepreg, and printed circuit board
- Patent number 11,503,708
- Issue date Nov 15, 2022
- ITEQ CORPORATION
- Yen-Hsing Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermally conductive resin, resin composition, prepreg, and copper...
- Patent number 10,752,744
- Issue date Aug 25, 2020
- Industrial Technology Research Institute
- Feng-Po Tseng
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Resin composition, prepreg, and copper clad laminate
- Patent number 10,696,783
- Issue date Jun 30, 2020
- ITEQ CORPORATION
- Chen-Hsi Cheng
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Halogen-free epoxy resin composition having low dielectric loss
- Patent number 10,611,910
- Issue date Apr 7, 2020
- ITEQ CORPORATION
- Kai-Yang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminated substrate
- Patent number 10,518,503
- Issue date Dec 31, 2019
- ITEQ CORPORATION
- Ta-Yuan Yu
- B32 - LAYERED PRODUCTS
Information Patent Grant
Polyimide resins containing polymaleic anhydride and method for man...
- Patent number 9,771,456
- Issue date Sep 26, 2017
- ITEQ Corporation
- Chao-Hui Kuo
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Electromagnetic interference shielding film
- Patent number 9,674,992
- Issue date Jun 6, 2017
- ITEQ Corporation
- Chen-Hsi Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low dielectric materials
- Patent number 9,455,067
- Issue date Sep 27, 2016
- ITEQ CORPORATION
- Meng-Song Yin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dielectric material with low dielectric loss
- Patent number 9,257,212
- Issue date Feb 9, 2016
- ITEQ Corporation
- Meng-Song Yin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 9,245,667
- Issue date Jan 26, 2016
- ITEQ Corporation
- Meng-Song Yin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Varnish composition, and pre-impregnated manufacture thereof
- Patent number 8,663,803
- Issue date Mar 4, 2014
- ITEQ Corporation
- Li-Chun Chen
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Thermosetting resin composition
- Patent number 8,217,099
- Issue date Jul 10, 2012
- Iteq (Dongguan) Corporation
- Yufang He
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Varnish, prepreg, and substrate thereof
- Patent number 8,206,819
- Issue date Jun 26, 2012
- ITEQ Corporation
- Lai Tu Liu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Halogen-free prepreg and resin for preparing the same
- Patent number 8,153,709
- Issue date Apr 10, 2012
- ITEQ Corporation
- Bin Jian
- B32 - LAYERED PRODUCTS
Information Patent Grant
Kind of prepolymer and its product-thermosetting resins composite
- Patent number 8,104,148
- Issue date Jan 31, 2012
- Iteq (Dongguan) Corporation
- Yufang He
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Varnish, prepreg, and substrate thereof
- Patent number 8,088,490
- Issue date Jan 3, 2012
- ITEQ Corporation
- Li-Chun Chen
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Varnish and prepreg, and substrates thereof
- Patent number 8,058,363
- Issue date Nov 15, 2011
- ITEQ Corporation
- Bin Jian
- B32 - LAYERED PRODUCTS
Information Patent Grant
Thermosetting resin for expediting a thermosetting process
- Patent number 8,017,671
- Issue date Sep 13, 2011
- ITEQ (WUXI) Electronic Technologies Co., Ltd.
- Yanhua Yuan
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Prepreg and resin for preparing the same
- Patent number 7,955,701
- Issue date Jun 7, 2011
- ITEQ Corporation
- Bin Jian
- B32 - LAYERED PRODUCTS
Information Patent Grant
Halogen-free varnish and prepreg thereof
- Patent number 7,842,401
- Issue date Nov 30, 2010
- ITEQ Corporation
- Li-Chun Chen
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Resin composition and application thereof
- Patent number 7,786,029
- Issue date Aug 31, 2010
- ITEQ Corporation
- Li-Chun Chen
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method of inhibition the growth of algae
- Patent number 7,612,049
- Issue date Nov 3, 2009
- ITEQ Corporation
- Chih-Ta Kao
- A01 - AGRICULTURE FORESTRY ANIMAL HUSBANDRY HUNTING TRAPPING FISHING

Patents Applicationslast 30 patents

Information Patent Application
RESIN COMPOSITION AND METAL CLAD SUBSTRATE
- Publication number 20240017525
- Publication date Jan 18, 2024
- ITEQ CORPORATION
- SHENG-YEN WU
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION AND METAL CLAD SUBSTRATE
- Publication number 20240002653
- Publication date Jan 4, 2024
- ITEQ CORPORATION
- SHENG-YEN WU
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
TOUGHENED RESIN COMPOSITION
- Publication number 20230348708
- Publication date Nov 2, 2023
- ITEQ CORPORATION
- Sheng-Yen WU
- B32 - LAYERED PRODUCTS
Information Patent Application
TOUGHENED RESIN COMPOSITION
- Publication number 20230348673
- Publication date Nov 2, 2023
- ITEQ CORPORATION
- Sheng-Yen WU
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
POLYMER MATRIX COMPOSITE, PREPREG AND PRINTED CIRCUIT BOARD FOR ELI...
- Publication number 20220153945
- Publication date May 19, 2022
- ITEQ CORPORATION
- TARUN AMLA
- B32 - LAYERED PRODUCTS
Information Patent Application
RESIN COMPOSITION, PREPREG, AND PRINTED CIRCUIT BOARD
- Publication number 20210298169
- Publication date Sep 23, 2021
- ITEQ CORPORATION
- YEN-HSING WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PREPREG, LAMINATED AND PRINTED CIRCUIT BOARD THEREOF
- Publication number 20210147646
- Publication date May 20, 2021
- ITEQ CORPORATION
- MING LIU
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
POLYMER MATRIX COMPOSITE, PREPREG AND PRINTED CIRCUIT BOARD FOR ELI...
- Publication number 20200413536
- Publication date Dec 31, 2020
- ITEQ CORPORATION
- TARUN AMLA
- B32 - LAYERED PRODUCTS
Information Patent Application
MULTI-LAYERED STRUCTURE AND SUBSTRATE
- Publication number 20190390061
- Publication date Dec 26, 2019
- ITEQ Corporation
- Chen-Hsi CHENG
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
LAMINATED SUBSTRATE
- Publication number 20190202168
- Publication date Jul 4, 2019
- ITEQ CORPORATION
- TA-YUAN YU
- B32 - LAYERED PRODUCTS
Information Patent Application
RESIN COMPOSITION, PREPREG, AND COPPER CLAD LAMINATE
- Publication number 20190194383
- Publication date Jun 27, 2019
- ITEQ Corporation
- Chen-Hsi CHENG
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
THERMALLY CONDUCTIVE RESIN, RESIN COMPOSITION, PREPREG, AND COPPER...
- Publication number 20190194408
- Publication date Jun 27, 2019
- Industrial Technology Research Institute
- Feng-Po TSENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POLYMER MATRIX COMPOSITE FOR ELIMINATING SKEW AND FIBER WEAVE EFFECT
- Publication number 20190104612
- Publication date Apr 4, 2019
- ITEQ CORPORATION
- TARUN AMLA
- B32 - LAYERED PRODUCTS
Information Patent Application
HALOGEN-FREE EPOXY RESIN COMPOSITION HAVING LOW DIELECTRIC LOSS
- Publication number 20180223094
- Publication date Aug 9, 2018
- ITEQ CORPORATION
- Kai-Yang CHEN
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
LOW DIELECTRIC MATERIALS
- Publication number 20160148719
- Publication date May 26, 2016
- ITEQ CORPORATION
- MENG-SONG YIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMAGNETIC INTERFERENCE SHIELDING FILM
- Publication number 20160007510
- Publication date Jan 7, 2016
- ITEQ CORPORATION
- Chen-Hsi CHENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HALOGEN-FREE EPOXY RESIN COMPOSITION FOR INTEGRATED CIRCUIT PACKAGING
- Publication number 20150148453
- Publication date May 28, 2015
- ITEQ CORPORATION
- Feng Tang
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ORGANIC-INORGANIC HYBRID MATERIAL FILM AND METHOD FOR MANUFACTURING...
- Publication number 20150038039
- Publication date Feb 5, 2015
- ITEQ CORPORATION
- Chao-Hui KUO
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
POLYIMIDE RESINS CONTAINING POLYMALEIC ANHYDRIDE AND METHOD FOR MAN...
- Publication number 20150004862
- Publication date Jan 1, 2015
- ITEQ CORPORATION
- Chao-Hui KUO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CIRCUIT BOARD
- Publication number 20140275335
- Publication date Sep 18, 2014
- ITEQ CORPORATION
- Meng-Song YIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC MATERIAL WITH LOW DIELECTRIC LOSS
- Publication number 20140275377
- Publication date Sep 18, 2014
- ITEQ CORPORATION
- Meng-Song YIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMAGNETIC INTERFERENCE SHIELDING STRUCTURE
- Publication number 20140093722
- Publication date Apr 3, 2014
- ITEQ CORPORATION
- Yun-Hsing SUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VARNISH, PREPREG, AND SUBSTRATE THEREOF
- Publication number 20110183144
- Publication date Jul 28, 2011
- ITEQ CORPORATION
- LAI TU LIU
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
VARNISH, PREPREG, AND SUBSTRATE THEREOF
- Publication number 20110097587
- Publication date Apr 28, 2011
- ITEQ CORPORATION
- Li-Chun Chen
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
HALOGEN-FREE VANISH AND PREPREG THEREOF
- Publication number 20100248570
- Publication date Sep 30, 2010
- ITEQ CORPORATION
- Li-Chun Chen
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
HALOGEN-FREE PREPREG AND RESIN FOR PREPARING THE SAME
- Publication number 20100155123
- Publication date Jun 24, 2010
- ITEQ CORPORATION
- Bin JIAN
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PREPREG AND RESIN FOR PREPARING THE SAME
- Publication number 20100159765
- Publication date Jun 24, 2010
- ITEQ CORPORATION
- Bin JIAN
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
BRIGHTNESS ENHANCEMENT COMPONENT
- Publication number 20100046103
- Publication date Feb 25, 2010
- ITEQ CORPORATION
- Tou-Sheng YEH
- G02 - OPTICS
Information Patent Application
Method of Inhibiting the Growth of Algae
- Publication number 20090280984
- Publication date Nov 12, 2009
- ITEQ CORPORATION
- Chih-Ta Kao
- A01 - AGRICULTURE FORESTRY ANIMAL HUSBANDRY HUNTING TRAPPING FISHING
Information Patent Application
Brightness Enhancement Component
- Publication number 20090231859
- Publication date Sep 17, 2009
- ITEQ CORPORATION
- Tou-Sheng Yeh
- G02 - OPTICS

ITEQ (DONGGUAN) CORPORATION

Organization

Patents Grantslast 30 patents

Resin composition, prepreg, and printed circuit board

Thermally conductive resin, resin composition, prepreg, and copper...

Resin composition, prepreg, and copper clad laminate

Halogen-free epoxy resin composition having low dielectric loss

Laminated substrate

Polyimide resins containing polymaleic anhydride and method for man...

Electromagnetic interference shielding film

Low dielectric materials

Dielectric material with low dielectric loss

Circuit board

Varnish composition, and pre-impregnated manufacture thereof

Thermosetting resin composition

Varnish, prepreg, and substrate thereof

Halogen-free prepreg and resin for preparing the same

Kind of prepolymer and its product-thermosetting resins composite

Varnish, prepreg, and substrate thereof

Varnish and prepreg, and substrates thereof

Thermosetting resin for expediting a thermosetting process

Prepreg and resin for preparing the same

Halogen-free varnish and prepreg thereof

Resin composition and application thereof

Method of inhibition the growth of algae

Patents Applicationslast 30 patents

RESIN COMPOSITION AND METAL CLAD SUBSTRATE

RESIN COMPOSITION AND METAL CLAD SUBSTRATE

TOUGHENED RESIN COMPOSITION

TOUGHENED RESIN COMPOSITION

POLYMER MATRIX COMPOSITE, PREPREG AND PRINTED CIRCUIT BOARD FOR ELI...

RESIN COMPOSITION, PREPREG, AND PRINTED CIRCUIT BOARD

PREPREG, LAMINATED AND PRINTED CIRCUIT BOARD THEREOF

POLYMER MATRIX COMPOSITE, PREPREG AND PRINTED CIRCUIT BOARD FOR ELI...

MULTI-LAYERED STRUCTURE AND SUBSTRATE

LAMINATED SUBSTRATE

RESIN COMPOSITION, PREPREG, AND COPPER CLAD LAMINATE

THERMALLY CONDUCTIVE RESIN, RESIN COMPOSITION, PREPREG, AND COPPER...

POLYMER MATRIX COMPOSITE FOR ELIMINATING SKEW AND FIBER WEAVE EFFECT

HALOGEN-FREE EPOXY RESIN COMPOSITION HAVING LOW DIELECTRIC LOSS

LOW DIELECTRIC MATERIALS

ELECTROMAGNETIC INTERFERENCE SHIELDING FILM

HALOGEN-FREE EPOXY RESIN COMPOSITION FOR INTEGRATED CIRCUIT PACKAGING

ORGANIC-INORGANIC HYBRID MATERIAL FILM AND METHOD FOR MANUFACTURING...

POLYIMIDE RESINS CONTAINING POLYMALEIC ANHYDRIDE AND METHOD FOR MAN...

CIRCUIT BOARD

DIELECTRIC MATERIAL WITH LOW DIELECTRIC LOSS

ELECTROMAGNETIC INTERFERENCE SHIELDING STRUCTURE

VARNISH, PREPREG, AND SUBSTRATE THEREOF

VARNISH, PREPREG, AND SUBSTRATE THEREOF

HALOGEN-FREE VANISH AND PREPREG THEREOF

HALOGEN-FREE PREPREG AND RESIN FOR PREPARING THE SAME

PREPREG AND RESIN FOR PREPARING THE SAME

BRIGHTNESS ENHANCEMENT COMPONENT

Method of Inhibiting the Growth of Algae

Brightness Enhancement Component

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