J-DEVICE CORPORATION

Organization

Oita, JP

Organizations

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and a method for manufacturing a semiconducto...
- Patent number 10,559,523
- Issue date Feb 11, 2020
- J-Devices Corporation
- Masafumi Suzuhara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method of semiconductor pac...
- Patent number 10,553,456
- Issue date Feb 4, 2020
- J-Devices Corporation
- Yasuyuki Takehara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor package including laser proce...
- Patent number 10,529,635
- Issue date Jan 7, 2020
- J-Devices Corporation
- Hisakazu Marutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Press fitting head and semiconductor manufacturing apparatus using...
- Patent number 10,388,625
- Issue date Aug 20, 2019
- J-DEVICES CORPORATION
- Minoru Kai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing same
- Patent number 10,256,196
- Issue date Apr 9, 2019
- J-Devices Corporation
- Kiminori Ishido
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,236,231
- Issue date Mar 19, 2019
- J-Devices Corporation
- Takeshi Miyakoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor package
- Patent number 10,224,256
- Issue date Mar 5, 2019
- J-DEVICES CORPORATION
- Hirokazu Machida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus having a pickup unit simultan...
- Patent number 10,157,760
- Issue date Dec 18, 2018
- J-DEVICES CORPORATION
- Minoru Kai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,134,710
- Issue date Nov 20, 2018
- J-DEVICES CORPORATION
- Takeshi Miyakoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor package
- Patent number 10,096,564
- Issue date Oct 9, 2018
- J-DEVICES CORPORATION
- Toshiyuki Inaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package to reduce warping
- Patent number 10,090,276
- Issue date Oct 2, 2018
- J-DEVICES CORPORATION
- Kiyoaki Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a semiconductor package
- Patent number 10,079,161
- Issue date Sep 18, 2018
- J-Devices Corporation
- Toshiyuki Inaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and a method for manufacturing a semiconducto...
- Patent number 10,062,638
- Issue date Aug 28, 2018
- J-DEVICES CORPORATION
- Masafumi Suzuhara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure, printed circuit board, semiconductor device...
- Patent number 9,922,931
- Issue date Mar 20, 2018
- J-Devices Corporation
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,905,536
- Issue date Feb 27, 2018
- J-DEVICES CORPORATION
- Makoto Moda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 9,837,382
- Issue date Dec 5, 2017
- J-DEVICE CORPORATION
- Shinji Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor package
- Patent number 9,786,611
- Issue date Oct 10, 2017
- J-DEVICES CORPORATION
- Kiyoaki Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and its manufacturing method
- Patent number 9,721,900
- Issue date Aug 1, 2017
- J-Devices Corporation
- Naoki Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 9,685,376
- Issue date Jun 20, 2017
- J-Devices Corporation
- Yoshihiko Ikemoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 9,635,762
- Issue date Apr 25, 2017
- J-DEVICES CORPORATION
- Shinji Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,627,289
- Issue date Apr 18, 2017
- J-Devices Corporation
- Yoshihiko Ikemoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 9,601,450
- Issue date Mar 21, 2017
- J-DEVICES CORPORATION
- Takeshi Miyakoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,595,488
- Issue date Mar 14, 2017
- J-DEVICES CORPORATION
- Yoshihiro Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic shielding package of non-volatile magnetic memory element
- Patent number 9,553,052
- Issue date Jan 24, 2017
- J-Devices Corporation
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 9,418,944
- Issue date Aug 16, 2016
- J-DEVICES CORPORATION
- Kiyoaki Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,412,685
- Issue date Aug 9, 2016
- J-Devices Corporation
- Yoshiyuki Tomonaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for semiconductor device
- Patent number 9,368,474
- Issue date Jun 14, 2016
- J-DEVICES CORPORATION
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink in the aperture of substrate
- Patent number 9,362,200
- Issue date Jun 7, 2016
- J-DEVICES CORPORATION
- Hirokazu Honda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, semiconductor stacked module structure, stack...
- Patent number 9,196,507
- Issue date Nov 24, 2015
- J-Devices Corporation
- Hiroshi Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, semiconductor stacked module structure, stack...
- Patent number 9,147,671
- Issue date Sep 29, 2015
- J-Devices Corporation
- Hiroshi Inoue
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICES WITH SHIELD
- Publication number 20200402919
- Publication date Dec 24, 2020
- J-DEVICES CORPORATION
- Yoshio Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20200388562
- Publication date Dec 10, 2020
- J-DEVICES CORPORATION
- Kenji NISHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND A METHOD FOR MANUFACTURING A SEMICONDUCTO...
- Publication number 20200152555
- Publication date May 14, 2020
- J-DEVICES CORPORATION
- Masafumi SUZUHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE, SEMICONDUCTOR PACKAGE HAVING THE WIRING SUBSTRATE...
- Publication number 20200066623
- Publication date Feb 27, 2020
- J-DEVICES CORPORATION
- Naoki HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200035582
- Publication date Jan 30, 2020
- J-DEVICES CORPORATION
- Masao HIROBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND A METHOD FOR MANUFACTURING A SEMICONDUCTO...
- Publication number 20180342443
- Publication date Nov 29, 2018
- J-DEVICES CORPORATION
- Masafumi Suzuhara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR PRODUCING SAME
- Publication number 20180174975
- Publication date Jun 21, 2018
- J-DEVICES CORPORATION
- Toshiyuki INAOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR PRODUCING SAME
- Publication number 20170373012
- Publication date Dec 28, 2017
- J-DEVICES CORPORATION
- Toshiyuki INAOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20170365534
- Publication date Dec 21, 2017
- J-DEVICES CORPORATION
- Hirokazu MACHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20170358462
- Publication date Dec 14, 2017
- J-DEVICES CORPORATION
- Seita ARAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR MANUFACTUR...
- Publication number 20170338136
- Publication date Nov 23, 2017
- J-DEVICES CORPORATION
- Minoru KAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20170317045
- Publication date Nov 2, 2017
- J-DEVICES CORPORATION
- Toshiyuki INAOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDUCTOR PAC...
- Publication number 20170316998
- Publication date Nov 2, 2017
- J-DEVICES CORPORATION
- Hisakazu MARUTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDUCTOR PAC...
- Publication number 20170316996
- Publication date Nov 2, 2017
- J-DEVICES CORPORATION
- Yasuyuki TAKEHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20170301599
- Publication date Oct 19, 2017
- J-DEVICES CORPORATION
- Takeshi MIYAKOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND A METHOD FOR MANUFACTURING A SEMICONDUCTO...
- Publication number 20170263537
- Publication date Sep 14, 2017
- J-DEVICES CORPORATION
- Masafumi Suzuhara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure, Printed Circuit Board, Semiconductor Device...
- Publication number 20170263560
- Publication date Sep 14, 2017
- J-DEVICES CORPORATION
- Hiroaki MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PAC...
- Publication number 20170256453
- Publication date Sep 7, 2017
- J-DEVICES CORPORATION
- Takahiro YADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR P...
- Publication number 20170207157
- Publication date Jul 20, 2017
- J-DEVICES CORPORATION
- Kiyoaki HASHIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE, SEMICONDUCTOR PACKAGE HAVING THE WIRING SUBSTRATE...
- Publication number 20170170106
- Publication date Jun 15, 2017
- J-DEVICES CORPORATION
- Naoki HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND ITS MANUFACTURING METHOD
- Publication number 20170170123
- Publication date Jun 15, 2017
- J-DEVICES CORPORATION
- Naoki HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20170148766
- Publication date May 25, 2017
- J-DEVICES CORPORATION
- Takeshi Miyakoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESS FITTING HEAD AND SEMICONDUCTOR MANUFACTURING APPARATUS USING...
- Publication number 20170110432
- Publication date Apr 20, 2017
- J-DEVICES CORPORATION
- Minoru KAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20170005044
- Publication date Jan 5, 2017
- J-DEVICES CORPORATION
- Kiminori ISHIDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20160351511
- Publication date Dec 1, 2016
- J-DEVICES CORPORATION
- Kiyoaki HASHIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20160300779
- Publication date Oct 13, 2016
- J-DEVICE CORPORATION
- Shinji WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20160233141
- Publication date Aug 11, 2016
- J-DEVICES CORPORATION
- Masao HIROBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20160225701
- Publication date Aug 4, 2016
- J-DEVICES CORPORATION
- Yoshihiro TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20160218086
- Publication date Jul 28, 2016
- J-DEVICES CORPORATION
- Makoto MODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20160181194
- Publication date Jun 23, 2016
- J-DEVICES CORPORATION
- Yoshihiko IKEMOTO
- H01 - BASIC ELECTRIC ELEMENTS

Trademarklast 30 trademarks

Information Trademark
86400542 - PLP
- Serial number 86400542
- Registration number 4793365
- Filing date Sep 19, 2014
- J-DEVICES CORPORATION
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments

J-DEVICE CORPORATION

Organization

Patents Grantslast 30 patents

Semiconductor package and a method for manufacturing a semiconducto...

Semiconductor package and manufacturing method of semiconductor pac...

Manufacturing method of semiconductor package including laser proce...

Press fitting head and semiconductor manufacturing apparatus using...

Semiconductor device and method for manufacturing same

Semiconductor device

Manufacturing method of semiconductor package

Semiconductor manufacturing apparatus having a pickup unit simultan...

Semiconductor package

Manufacturing method of semiconductor package

Semiconductor package to reduce warping

Method for producing a semiconductor package

Semiconductor package and a method for manufacturing a semiconducto...

Interconnect structure, printed circuit board, semiconductor device...

Semiconductor device

Semiconductor package and manufacturing method thereof

Method for manufacturing a semiconductor package

Semiconductor package and its manufacturing method

Semiconductor device and method of manufacturing semiconductor device

Semiconductor package

Semiconductor device

Semiconductor package

Semiconductor device

Magnetic shielding package of non-volatile magnetic memory element

Semiconductor package

Semiconductor device and method of manufacturing the same

Manufacturing method for semiconductor device

Heat sink in the aperture of substrate

Semiconductor device, semiconductor stacked module structure, stack...

Semiconductor device, semiconductor stacked module structure, stack...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICES WITH SHIELD

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND A METHOD FOR MANUFACTURING A SEMICONDUCTO...

WIRING SUBSTRATE, SEMICONDUCTOR PACKAGE HAVING THE WIRING SUBSTRATE...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND A METHOD FOR MANUFACTURING A SEMICONDUCTO...

SEMICONDUCTOR PACKAGE AND METHOD FOR PRODUCING SAME

SEMICONDUCTOR PACKAGE AND METHOD FOR PRODUCING SAME

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR MANUFACTUR...

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDUCTOR PAC...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDUCTOR PAC...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND A METHOD FOR MANUFACTURING A SEMICONDUCTO...

Interconnect Structure, Printed Circuit Board, Semiconductor Device...

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PAC...

METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR P...

WIRING SUBSTRATE, SEMICONDUCTOR PACKAGE HAVING THE WIRING SUBSTRATE...

SEMICONDUCTOR PACKAGE AND ITS MANUFACTURING METHOD

SEMICONDUCTOR PACKAGE

PRESS FITTING HEAD AND SEMICONDUCTOR MANUFACTURING APPARATUS USING...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

Trademarklast 30 trademarks

86400542 - PLP