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Patents Grantslast 30 patents

Information Patent Grant
Integrated package structure for MEMS element and ASIC chip and met...
- Patent number 11,130,674
- Issue date Sep 28, 2021
- J-METRICS TECHNOLOGY CO., LTD.
- Sheng-Lin Ma
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Ultrasonic module and method for manufacturing the same
- Patent number 10,657,349
- Issue date May 19, 2020
- J-METRICS TECHNOLOGY CO., LTD.
- Yu-Feng Jin
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED PACKAGE STRUCTURE FOR MEMS ELEMENT AND ASIC CHIP AND MET...
- Publication number 20200262700
- Publication date Aug 20, 2020
- J-METRICS TECHNOLOGY Co., Ltd.
- Sheng-Lin Ma
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ULTRASONIC MODULE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190080132
- Publication date Mar 14, 2019
- J-METRICS TECHNOLOGY Co., Ltd.
- Yu-Feng JIN
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL

Trademarklast 30 trademarks