J-METRICS TECHNOLOGY CO., LTD.

Organization

Taipei City, TW

Organizations

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Wafer level ultrasonic chip module having suspension structure and...
- Patent number 11,478,822
- Issue date Oct 25, 2022
- J-Metrics Technology Co., Ltd.
- Yu-Feng Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer scale ultrasonic sensor assembly and method for manufacturing...
- Patent number 11,460,341
- Issue date Oct 4, 2022
- J-Metrics Technology Co., Ltd.
- Yu-Feng Jin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wafer scale ultrasonic sensing device and manufacturing method thereof
- Patent number 11,075,072
- Issue date Jul 27, 2021
- J-Metrics Technology Co., Ltd.
- Yu-Feng Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensing unit and fingerprint sensing module
- Patent number 10,061,965
- Issue date Aug 28, 2018
- J-Metrics Technology Co., Ltd.
- Wei-Ting Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
All-flat sensor with exposed colorful member and electronic device...
- Patent number 9,824,257
- Issue date Nov 21, 2017
- J-Metrics Technology Co., Ltd.
- Bruce C. S. Chou
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Suspended capacitive fingerprint sensor and method for manufacturin...
- Patent number 9,684,811
- Issue date Jun 20, 2017
- J-Metrics Technology Co., Ltd.
- Wei-Ting Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fingerprint sensor packaging module and manufacturing method thereof
- Patent number 9,679,188
- Issue date Jun 13, 2017
- J-Metrics Technology Co., Ltd.
- Wei-Ting Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fingerprint identification device
- Patent number 9,553,062
- Issue date Jan 24, 2017
- J-Metrics Technology Co., Ltd.
- Chen-Chih Fan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic apparatus with segmented guiding function and small-widt...
- Patent number 9,436,862
- Issue date Sep 6, 2016
- J-Metrics Technology Co., Ltd.
- Jer-Wei Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stray-light-coupled biometrics sensing module and electronic appara...
- Patent number 9,298,317
- Issue date Mar 29, 2016
- J-Metrics Technology Co., Ltd.
- Bruce C. S. Chou
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Biometrics sensor module, assembly, manufacturing method and electr...
- Patent number 9,058,511
- Issue date Jun 16, 2015
- J-Metrics Technology Co., Ltd.
- Bruce C. S. Chou
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Ultra-thin sensing device with flat contact surface
- Patent number 9,008,376
- Issue date Apr 14, 2015
- J-Metrics Technology Co., Ltd.
- Li-Kuo Chiu
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
WAFER LEVEL ULTRASONIC CHIP MODULE HAVING SUSPENSION STRUCTURE
- Publication number 20230014827
- Publication date Jan 19, 2023
- J-METRICS TECHNOLOGY CO., LTD.
- Yu-Feng Jin
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Application
ARRAY-TYPE ULTRASONIC SENSOR
- Publication number 20220226862
- Publication date Jul 21, 2022
- J-METRICS TECHNOLOGY CO., LTD.
- Yi-Hsiang Chiu
- G01 - MEASURING TESTING
Information Patent Application
WAFER LEVEL ULTRASONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20210170448
- Publication date Jun 10, 2021
- J-METRICS TECHNOLOGY CO., LTD.
- Yi-Hsiang CHIU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WAFER SCALE ULTRASONIC SENSING DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20210013026
- Publication date Jan 14, 2021
- J-METRICS TECHNOLOGY CO., LTD.
- Yu-Feng JIN
- B24 - GRINDING POLISHING
Information Patent Application
MASS TRANSFER METHOD FOR MICRO LIGHT EMITTING DIODE AND LIGHT EMITT...
- Publication number 20200203319
- Publication date Jun 25, 2020
- J-METRICS TECHNOLOGY CO., LTD.
- Hung-Ping LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL ULTRASONIC CHIP MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20200179979
- Publication date Jun 11, 2020
- J-METRICS TECHNOLOGY CO., LTD.
- Yu-Feng JIN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WAFER LEVEL ULTRASONIC CHIP MODULE HAVING SUSPENSION STRUCTURE AND...
- Publication number 20200164406
- Publication date May 28, 2020
- J-METRICS TECHNOLOGY CO., LTD.
- Yu-Feng JIN
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Application
FINGERPRINT SENSING UNIT
- Publication number 20180336393
- Publication date Nov 22, 2018
- J-METRICS TECHNOLOGY Co., Ltd.
- Wei-Ting Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FINGERPRINT SENSOR PACKAGING MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20170091517
- Publication date Mar 30, 2017
- J-METRICS TECHNOLOGY Co., Ltd.
- Wei-Ting Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FINGERPRINT SENSING UNIT AND FINGERPRINT SENSING MODULE
- Publication number 20170076134
- Publication date Mar 16, 2017
- J-METRICS TECHNOLOGY Co., Ltd.
- WEI-TING LIN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SUSPENDED CAPACITIVE FINGERPRINT SENSOR AND METHOD FOR MANUFACTURIN...
- Publication number 20160275333
- Publication date Sep 22, 2016
- J-METRICS TECHNOLOGY Co., Ltd.
- Wei-Ting Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC APPARATUS HAVING FINGERPRINT SENSOR OPERATING IN VECTOR...
- Publication number 20160224775
- Publication date Aug 4, 2016
- J-METRICS TECHNOLOGY Co., Ltd.
- Wei-Ting Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ALL-FLAT SENSOR WITH EXPOSED COLORFUL MEMBER AND ELECTRONIC DEVICE...
- Publication number 20150269407
- Publication date Sep 24, 2015
- J-METRICS TECHNOLOGY CO., LTD.
- Bruce C.S. CHOU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Biometrics Sensor Having Flat Contact Surface Formed by Signal Exte...
- Publication number 20150235071
- Publication date Aug 20, 2015
- J-METRICS TECHNOLOGY CO., LTD.
- Jer-Wei CHANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CAPACITIVE SENSING ARRAY DEVICE WITH HIGH SENSITIVITY AND HIGH FRAM...
- Publication number 20150233989
- Publication date Aug 20, 2015
- J-METRICS TECHNOLOGY CO., LTD.
- Bruce C.S. CHOU
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC DEVICE WITH MULTI-FUNCTION SENSOR AND METHOD OF OPERATIN...
- Publication number 20150185954
- Publication date Jul 2, 2015
- J-METRICS TECHNOLOGY CO., LTD.
- JER-WEI CHANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Proximity Sensor with Hidden Couple Electrode and Method of Manufac...
- Publication number 20150163907
- Publication date Jun 11, 2015
- J-METRICS TECHNOLOGY CO., LTD.
- Jer-Wei CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

J-METRICS TECHNOLOGY CO., LTD.

Organization

Patents Grantslast 30 patents

Wafer level ultrasonic chip module having suspension structure and...

Wafer scale ultrasonic sensor assembly and method for manufacturing...

Wafer scale ultrasonic sensing device and manufacturing method thereof

Fingerprint sensing unit and fingerprint sensing module

All-flat sensor with exposed colorful member and electronic device...

Suspended capacitive fingerprint sensor and method for manufacturin...

Fingerprint sensor packaging module and manufacturing method thereof

Fingerprint identification device

Electronic apparatus with segmented guiding function and small-widt...

Stray-light-coupled biometrics sensing module and electronic appara...

Biometrics sensor module, assembly, manufacturing method and electr...

Ultra-thin sensing device with flat contact surface

Patents Applicationslast 30 patents

WAFER LEVEL ULTRASONIC CHIP MODULE HAVING SUSPENSION STRUCTURE

ARRAY-TYPE ULTRASONIC SENSOR

WAFER LEVEL ULTRASONIC DEVICE AND MANUFACTURING METHOD THEREOF

WAFER SCALE ULTRASONIC SENSING DEVICE AND MANUFACTURING METHOD THEREOF

MASS TRANSFER METHOD FOR MICRO LIGHT EMITTING DIODE AND LIGHT EMITT...

WAFER LEVEL ULTRASONIC CHIP MODULE AND MANUFACTURING METHOD THEREOF

WAFER LEVEL ULTRASONIC CHIP MODULE HAVING SUSPENSION STRUCTURE AND...

FINGERPRINT SENSING UNIT

FINGERPRINT SENSOR PACKAGING MODULE AND MANUFACTURING METHOD THEREOF

FINGERPRINT SENSING UNIT AND FINGERPRINT SENSING MODULE

SUSPENDED CAPACITIVE FINGERPRINT SENSOR AND METHOD FOR MANUFACTURIN...

ELECTRONIC APPARATUS HAVING FINGERPRINT SENSOR OPERATING IN VECTOR...

ALL-FLAT SENSOR WITH EXPOSED COLORFUL MEMBER AND ELECTRONIC DEVICE...

Biometrics Sensor Having Flat Contact Surface Formed by Signal Exte...

CAPACITIVE SENSING ARRAY DEVICE WITH HIGH SENSITIVITY AND HIGH FRAM...

ELECTRONIC DEVICE WITH MULTI-FUNCTION SENSOR AND METHOD OF OPERATIN...

Proximity Sensor with Hidden Couple Electrode and Method of Manufac...

Trademarklast 30 trademarks