Japan Rec Co., Ltd.

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Takatsuki, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method for production of semiconductor package
- Patent number 6,063,646
- Issue date May 16, 2000
- Japan Rec Co., Ltd.
- Atsushi Okuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of sealing electric parts mounted on electric wiring board w...
- Patent number 5,232,651
- Issue date Aug 3, 1993
- Japan Rec Co., Ltd.
- Atsushi Okuno
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL