JCET SEMICONDUCTOR (SUQIAN) CO., LTD.

Organization

Suqian City,, CN

Organizations

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of forming ultra high density embed...
- Patent number 12,148,677
- Issue date Nov 19, 2024
- JCET Semiconductor (Shaoxing) Co., Ltd.
- See Chian Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making wafer level chip scale pa...
- Patent number 11,676,938
- Issue date Jun 13, 2023
- JCET Semiconductor (Shaoxing) Co., Ltd.
- Ming-Che Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming encapsulated wafer level...
- Patent number 11,257,729
- Issue date Feb 22, 2022
- JCET Semiconductor (Shaoxing) Co., Ltd.
- Thomas J. Strothmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming ultra high density embed...
- Patent number 11,227,809
- Issue date Jan 18, 2022
- JCET Semiconductor (Shaoxing) Co., Ltd.
- See Chian Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming double-sided fan-out waf...
- Patent number 11,127,668
- Issue date Sep 21, 2021
- JCET Semiconductor (Shaoxing) Co., Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming sacrificial adhesive ove...
- Patent number 10,998,248
- Issue date May 4, 2021
- JCET Semiconductor (Shaoxing) Co. Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming reconstituted wafer with...
- Patent number 10,916,482
- Issue date Feb 9, 2021
- JCET Semiconductor (Shaoxing) Co., Ltd.
- Yoke Hor Phua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming interposer frame over se...
- Patent number RE48408
- Issue date Jan 26, 2021
- JCET Semiconductor (Shaoxing) Co., Ltd.
- Reza A. Pagaila
Information Patent Grant
Semiconductor device and method of using leadframe bodies to form o...
- Patent number 10,903,183
- Issue date Jan 26, 2021
- JCET Semiconductor (Shaoxing) Co., Ltd.
- HeeJo Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming interposer frame over se...
- Patent number RE48111
- Issue date Jul 21, 2020
- JCET Semiconductor (Shaoxing) Co. Ltd.
- Reza A. Pagaila
Information Patent Grant
Semiconductor device and method of using partial wafer singulation...
- Patent number 10,665,534
- Issue date May 26, 2020
- JCET Semiconductor (Shaoxing) Co., Ltd.
- KyungHoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming wafer level ground plane...
- Patent number 10,651,139
- Issue date May 12, 2020
- JCET Semiconductor (Shaoxing) Co., Ltd.
- Guruprasad G. Badakere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming EMI shielding layer with...
- Patent number 10,643,952
- Issue date May 5, 2020
- JCET Semiconductor (Shaoxing) Co., Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for forming a low profile embedded...
- Patent number 10,622,293
- Issue date Apr 14, 2020
- JCET Semiconductor (Shaoxing) Co., Ltd.
- Seung Wook Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming interconnect substrate f...
- Patent number 10,607,946
- Issue date Mar 31, 2020
- JCET Semiconductor (Shaoxing) Co., Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGING MEMBER, SEMICONDUCT...
- Publication number 20230411252
- Publication date Dec 21, 2023
- JCET SEMICONDUCTOR (SUQIAN) CO., LTD.
- KAI LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGING MEMBER, SEMICONDUCT...
- Publication number 20230411256
- Publication date Dec 21, 2023
- JCET SEMICONDUCTOR (SUQIAN) CO., LTD.
- KAI LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Ultra High Density Embed...
- Publication number 20220093479
- Publication date Mar 24, 2022
- JCET Semiconductor (Shaoxing) Co., Ltd.
- See Chian Lim
- H01 - BASIC ELECTRIC ELEMENTS

JCET SEMICONDUCTOR (SUQIAN) CO., LTD.

Organization

Patents Grantslast 30 patents

Semiconductor device and method of forming ultra high density embed...

Semiconductor device and method of making wafer level chip scale pa...

Semiconductor device and method of forming encapsulated wafer level...

Semiconductor device and method of forming ultra high density embed...

Semiconductor device and method of forming double-sided fan-out waf...

Semiconductor device and method of forming sacrificial adhesive ove...

Semiconductor device and method of forming reconstituted wafer with...

Semiconductor device and method of forming interposer frame over se...

Semiconductor device and method of using leadframe bodies to form o...

Semiconductor device and method of forming interposer frame over se...

Semiconductor device and method of using partial wafer singulation...

Semiconductor device and method of forming wafer level ground plane...

Semiconductor device and method of forming EMI shielding layer with...

Semiconductor device and method for forming a low profile embedded...

Semiconductor device and method of forming interconnect substrate f...

Patents Applicationslast 30 patents

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGING MEMBER, SEMICONDUCT...

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGING MEMBER, SEMICONDUCT...

Semiconductor Device and Method of Forming Ultra High Density Embed...

Trademarklast 30 trademarks