Jentech Precision Industrial Co., LTD.

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Gueishan, TW

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Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method of insulated metal substrate
- Patent number 12,096,569
- Issue date Sep 17, 2024
- Jentech Precision Industrial Co., LTD.
- Chun-Ta Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vapor chamber
- Patent number 11,985,796
- Issue date May 14, 2024
- Jentech Precision Industrial Co., LTD.
- Chun-Ta Yeh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead frame structure and manufacturing method thereof
- Patent number 11,984,385
- Issue date May 14, 2024
- Jentech Precision Industrial Co., LTD.
- Jian-Tsai Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packing box and packing method of heat spreader
- Patent number 11,834,225
- Issue date Dec 5, 2023
- Jentech Precision Industrial Co., LTD.
- Chin-Long Lin
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Manufacturing method of light emitting diode module
- Patent number 11,705,547
- Issue date Jul 18, 2023
- Jentech Precision Industrial Co., LTD.
- Jian-Tsai Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreading plate
- Patent number 11,404,344
- Issue date Aug 2, 2022
- Jentech Precision Industrial Co., LTD.
- Chun-Ta Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulated metal substrate
- Patent number 11,388,823
- Issue date Jul 12, 2022
- Jentech Precision Industrial Co., LTD.
- Chun-Ta Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulated metal substrate and manufacturing method thereof
- Patent number 11,083,087
- Issue date Aug 3, 2021
- Jentech Precision Industrial Co., LTD.
- Chun-Ta Yeh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
VAPOR CHAMBER LID AND MANUFACTURING METHOD THEREOF
- Publication number 20240397668
- Publication date Nov 28, 2024
- Jentech Precision Industrial Co., LTD.
- Chun-Ta YEH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240355639
- Publication date Oct 24, 2024
- Jentech Precision Industrial Co., LTD.
- Chin-Jui YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING VAPOR CHAMBER
- Publication number 20240090171
- Publication date Mar 14, 2024
- Jentech Precision Industrial Co., LTD.
- Chun-Ta YEH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT EMITTING DIODE MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20230343901
- Publication date Oct 26, 2023
- Jentech Precision Industrial Co., LTD.
- Jian-Tsai CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VAPOR CHAMBER LID AND MANUFACTURING METHOD THEREOF
- Publication number 20230171929
- Publication date Jun 1, 2023
- Jentech Precision Industrial Co., LTD.
- Chun-Ta YEH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VAPOR CHAMBER AND METHOD FOR MANUFACTURING THEREOF
- Publication number 20220312640
- Publication date Sep 29, 2022
- Jentech Precision Industrial Co., LTD.
- Chun-Ta YEH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEAD FRAME STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220254705
- Publication date Aug 11, 2022
- Jentech Precision Industrial Co., LTD.
- Jian-Tsai CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKING BOX AND PACKING METHOD OF HEAT SPREADER
- Publication number 20220081166
- Publication date Mar 17, 2022
- Jentech Precision Industrial Co., LTD.
- Chin-Long LIN
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
LIGHT EMITTING DIODE MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20210367123
- Publication date Nov 25, 2021
- Jentech Precision Industrial Co., LTD.
- Jian-Tsai CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SPREADING PLATE
- Publication number 20210143077
- Publication date May 13, 2021
- Jentech Precision Industrial Co., LTD.
- Chun-Ta YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATED METAL SUBSTRATE
- Publication number 20210045239
- Publication date Feb 11, 2021
- Jentech Precision Industrial Co., LTD.
- Chun-Ta YEH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF INSULATED METAL SUBSTRATE
- Publication number 20210045240
- Publication date Feb 11, 2021
- Jentech Precision Industrial Co., LTD.
- Chun-Ta YEH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INSULATED METAL SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20200229303
- Publication date Jul 16, 2020
- Jentech Precision Industrial Co., LTD.
- Chun-Ta YEH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESSOR SOCKET ASSEMBLY AND CARRIER THEREOF
- Publication number 20190221492
- Publication date Jul 18, 2019
- Jentech Precision Industrial Co., LTD.
- Chang-Chi YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASTIC UNIT INTERNALLY EMBEDDED WITH ANTENNA AND MANUFACTURING MET...
- Publication number 20130127684
- Publication date May 23, 2013
- Jentech Precision Industrial Co., LTD.
- Hsin-Hsien Li
- H01 - BASIC ELECTRIC ELEMENTS

Jentech Precision Industrial Co., LTD.

Organization

Patents Grantslast 30 patents

Manufacturing method of insulated metal substrate

Vapor chamber

Lead frame structure and manufacturing method thereof

Packing box and packing method of heat spreader

Manufacturing method of light emitting diode module

Heat spreading plate

Insulated metal substrate

Insulated metal substrate and manufacturing method thereof

Patents Applicationslast 30 patents

VAPOR CHAMBER LID AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

METHOD FOR MANUFACTURING VAPOR CHAMBER

LIGHT EMITTING DIODE MODULE AND MANUFACTURING METHOD THEREOF

VAPOR CHAMBER LID AND MANUFACTURING METHOD THEREOF

VAPOR CHAMBER AND METHOD FOR MANUFACTURING THEREOF

LEAD FRAME STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKING BOX AND PACKING METHOD OF HEAT SPREADER

LIGHT EMITTING DIODE MODULE AND MANUFACTURING METHOD THEREOF

HEAT SPREADING PLATE

INSULATED METAL SUBSTRATE

MANUFACTURING METHOD OF INSULATED METAL SUBSTRATE

INSULATED METAL SUBSTRATE AND MANUFACTURING METHOD THEREOF

PROCESSOR SOCKET ASSEMBLY AND CARRIER THEREOF

PLASTIC UNIT INTERNALLY EMBEDDED WITH ANTENNA AND MANUFACTURING MET...

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