J.G. Systems, Inc.

Organization

Miami, FL, US

Organizations

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Patents Grantslast 30 patents

Information Patent Grant
Method and composition to minimize dishing
- Patent number 7,247,557
- Issue date Jul 24, 2007
- J.G. Systems, Inc.
- John Grunwald
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
CMP composition containing organic nitro compounds
- Patent number 7,148,147
- Issue date Dec 12, 2006
- J.G. Systems, Inc.
- John Grunwald
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
CMP composition containing organic nitro compounds
- Patent number 6,998,066
- Issue date Feb 14, 2006
- J.G. Systems, Inc.
- John Grunwald
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
CMP composition and process
- Patent number 6,955,586
- Issue date Oct 18, 2005
- J.G. Systems, Inc.
- John Grunwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Abrasives for CMP applications
- Patent number 6,896,710
- Issue date May 24, 2005
- J.G. Systems, Inc.
- John Grunwald
- B24 - GRINDING POLISHING
Information Patent Grant
Fixed abrasive CMP pad with built-in additives
- Patent number 6,875,097
- Issue date Apr 5, 2005
- J.G. Systems, Inc.
- John Grunwald
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for improving interfacial chemical reactions
- Patent number 6,805,911
- Issue date Oct 19, 2004
- J.G. Systems, Inc.
- John Grunwald
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for improving interfacial chemical reactions i...
- Patent number 6,599,563
- Issue date Jul 29, 2003
- J.G. Systems Inc.
- John Grunwald
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for electroless copper deposition using a hypophosphite redu...
- Patent number 6,524,490
- Issue date Feb 25, 2003
- J.G. Systems Inc.
- John Grunwald
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Laser imaging of printed circuit patterns without using phototools
- Patent number 5,895,581
- Issue date Apr 20, 1999
- J.G. Systems Inc.
- John Grunwald
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

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Patents Applicationslast 30 patents

Information Patent Application
METHOD AND COMPOSITION TO ENHANCE CORROSION RESISTANCE OF THROUGH H...
- Publication number 20100215840
- Publication date Aug 26, 2010
- J.G. Systems Inc.
- John J. Grunwald
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

J.G. Systems, Inc.

Organization

Patents Grantslast 30 patents

Method and composition to minimize dishing

CMP composition containing organic nitro compounds

CMP composition containing organic nitro compounds

CMP composition and process

Abrasives for CMP applications

Fixed abrasive CMP pad with built-in additives

Method and apparatus for improving interfacial chemical reactions

Method and apparatus for improving interfacial chemical reactions i...

Method for electroless copper deposition using a hypophosphite redu...

Laser imaging of printed circuit patterns without using phototools

Patents Applicationslast 30 patents

METHOD AND COMPOSITION TO ENHANCE CORROSION RESISTANCE OF THROUGH H...