JMJ KOREA CO., LTD.

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Bucheon-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 12,170,260
- Issue date Dec 17, 2024
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number D1049065
- Issue date Oct 29, 2024
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
System for cooling semiconductor component, method of manufacturing...
- Patent number 12,027,445
- Issue date Jul 2, 2024
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling system where semiconductor component comprising semiconduct...
- Patent number 11,908,766
- Issue date Feb 20, 2024
- JMJ Korea Co., Ltd.
- Yun Hwa Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, method of manufacturing the same and metal b...
- Patent number 11,908,824
- Issue date Feb 20, 2024
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for attaching semiconductor parts
- Patent number 11,823,920
- Issue date Nov 21, 2023
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor package with metal post having non-vertical structure
- Patent number 11,798,864
- Issue date Oct 24, 2023
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coupled semiconductor package
- Patent number 11,721,615
- Issue date Aug 8, 2023
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with heat radiation board
- Patent number 11,682,610
- Issue date Jun 20, 2023
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,676,931
- Issue date Jun 13, 2023
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor having double-sided substrate
- Patent number 11,631,627
- Issue date Apr 18, 2023
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plurality of power semiconductor chips between a substrate and lead...
- Patent number 11,521,920
- Issue date Dec 6, 2022
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertically attaching a chip to a substrate
- Patent number 11,482,463
- Issue date Oct 25, 2022
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 11,417,577
- Issue date Aug 16, 2022
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal powder layers between substrate, semiconductor chip and condu...
- Patent number 11,393,744
- Issue date Jul 19, 2022
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clip, lead frame, and substrate used in semiconductor package havin...
- Patent number 11,367,666
- Issue date Jun 21, 2022
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressurizing members for semiconductor package
- Patent number 11,362,021
- Issue date Jun 14, 2022
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink board for a semiconductor device
- Patent number 11,289,397
- Issue date Mar 29, 2022
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,270,969
- Issue date Mar 8, 2022
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-cost semiconductor package using conductive metal structure
- Patent number 11,189,550
- Issue date Nov 30, 2021
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink board, manufacturing method thereof, and semiconductor pa...
- Patent number 11,171,074
- Issue date Nov 9, 2021
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having exposed heat sink for high thermal con...
- Patent number 11,127,663
- Issue date Sep 21, 2021
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pressing-type semiconductor power device package
- Patent number 11,056,420
- Issue date Jul 6, 2021
- JMJ KOREA CO., LTD.
- Yunhwa Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer clip structure attached to a chip
- Patent number 10,896,889
- Issue date Jan 19, 2021
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Press-fit pin, semiconductor package having the same and method for...
- Patent number 10,855,009
- Issue date Dec 1, 2020
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of bonding terminal of semiconductor chip using solder bump...
- Patent number 10,714,450
- Issue date Jul 14, 2020
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Press-fit pin and semiconductor package including the same
- Patent number 10,541,197
- Issue date Jan 21, 2020
- JMJ Korea Co., Ltd.
- Yun Hwa Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clip structure and semiconductor package using the same
- Patent number 10,535,589
- Issue date Jan 14, 2020
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package having heat dissipating structure
- Patent number 10,438,873
- Issue date Oct 8, 2019
- JMJ KOREA CO., LTD.
- Yunhwa Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clip-bonded semiconductor chip package using metal bumps and method...
- Patent number 10,256,207
- Issue date Apr 9, 2019
- JMJ KOREA CO., LTD.
- Yunhwa Choi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ULTRASONIC WELDING SYSTEM AND POWER MODULE PACKAGE FOR POWER CONVER...
- Publication number 20250018498
- Publication date Jan 16, 2025
- JMJ Korea Co., Ltd.
- Yun Hwa CHOI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL CLIP STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240395761
- Publication date Nov 28, 2024
- JMJ Korea Co., Ltd.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR BONDING CLIP, METHOD OF BONDING CLIP, AND SEMICONDUCT...
- Publication number 20240379612
- Publication date Nov 14, 2024
- JMJ Korea Co., Ltd.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240355723
- Publication date Oct 24, 2024
- JMJ Korea Co., Ltd.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING HEAT EMITTING POST BONDED THERETO AND...
- Publication number 20240297096
- Publication date Sep 5, 2024
- JMJ Korea Co., Ltd.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SUBSTRATE, SEMICONDUCTOR PACKAGE HAVING DOUBLE-SIDED SUBSTR...
- Publication number 20240290700
- Publication date Aug 29, 2024
- JMJ Korea Co., Ltd.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240250057
- Publication date Jul 25, 2024
- JMJ Korea Co., Ltd.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240234288
- Publication date Jul 11, 2024
- JMJ Korea Co., Ltd.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240178094
- Publication date May 30, 2024
- JMJ Korea Co., Ltd.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE MODULE INCLUDING VERTICAL TERMINALS
- Publication number 20230326830
- Publication date Oct 12, 2023
- JMJ Korea Co., Ltd.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING NEGATIVE PATTERNED SUBSTRATE AND METHO...
- Publication number 20230282566
- Publication date Sep 7, 2023
- JMJ Korea Co., Ltd.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING HEAT RADIATION STRUCTURE, COOLING S...
- Publication number 20230268252
- Publication date Aug 24, 2023
- JMJ KOREA CO., LTD.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20230238297
- Publication date Jul 27, 2023
- JMJ Korea Co., Ltd.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING PACKAGE HOUSING IN ENGRAVED SURFACE FO...
- Publication number 20230011694
- Publication date Jan 12, 2023
- JMJ KOREA CO., LTD.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLIP STRUCTURE FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE...
- Publication number 20220399300
- Publication date Dec 15, 2022
- JMJ KOREA CO., LTD.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, METHOD OF MANUFACTURING THE SAME AND METAL B...
- Publication number 20220359452
- Publication date Nov 10, 2022
- JMJ KOREA CO., LTD.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING SYSTEM WHERE SEMICONDUCTOR COMPONENT COMPRISING SEMICONDUCT...
- Publication number 20220319946
- Publication date Oct 6, 2022
- JMJ Korea Co., Ltd.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220285304
- Publication date Sep 8, 2022
- JMJ KOREA CO., LTD.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM FOR COOLING SEMICONDUCTOR COMPONENT, METHOD OF MANUFACTURING...
- Publication number 20220246494
- Publication date Aug 4, 2022
- JMJ KOREA CO., LTD.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220223504
- Publication date Jul 14, 2022
- JMJ KOREA CO., LTD.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220148998
- Publication date May 12, 2022
- JMJ KOREA CO., LTD.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COUPLED SEMICONDUCTOR PACKAGE
- Publication number 20220051969
- Publication date Feb 17, 2022
- JMJ KOREA CO., LTD.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210366799
- Publication date Nov 25, 2021
- JMJ KOREA CO., LTD.
- Yun Hwa CHOI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL POST, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD OF...
- Publication number 20210358832
- Publication date Nov 18, 2021
- JMJ KOREA CO., LTD.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210343631
- Publication date Nov 4, 2021
- JMJ KOREA CO., LTD.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR HAVING DOUBLE-SIDED SUBSTRATE
- Publication number 20210335691
- Publication date Oct 28, 2021
- JMJ KOREA CO., LTD.
- Yun Hwa CHOI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS FOR ATTACHING SEMICONDUCTOR PARTS
- Publication number 20210320019
- Publication date Oct 14, 2021
- JMJ KOREA CO., LTD.
- Yun Hwa CHOI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
PRESSURIZED SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210280501
- Publication date Sep 9, 2021
- JMJ KOREA CO., LTD.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210249342
- Publication date Aug 12, 2021
- JMJ KOREA CO., LTD.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE USING CONDUCTIVE METAL STRUCTURE
- Publication number 20210166997
- Publication date Jun 3, 2021
- JMJ Korea Co., Ltd.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS

Trademarklast 30 trademarks

Information Trademark
98081372
- Serial number 98081372
- Filing date Jul 12, 2023
- JMJ Korea Co., Ltd.
- 7 - Machines and machine tools
Information Trademark
98081363 - JMJ KOREA
- Serial number 98081363
- Filing date Jul 12, 2023
- JMJ Korea Co., Ltd.
- 7 - Machines and machine tools

JMJ KOREA CO., LTD.

Organization

Patents Grantslast 30 patents

Semiconductor package and method of manufacturing the same

Semiconductor package

System for cooling semiconductor component, method of manufacturing...

Cooling system where semiconductor component comprising semiconduct...

Semiconductor package, method of manufacturing the same and metal b...

Apparatus for attaching semiconductor parts

Semiconductor package with metal post having non-vertical structure

Coupled semiconductor package

Semiconductor package with heat radiation board

Semiconductor package

Method of manufacturing semiconductor having double-sided substrate

Plurality of power semiconductor chips between a substrate and lead...

Vertically attaching a chip to a substrate

Semiconductor package and method of manufacturing the same

Metal powder layers between substrate, semiconductor chip and condu...

Clip, lead frame, and substrate used in semiconductor package havin...

Pressurizing members for semiconductor package

Heat sink board for a semiconductor device

Semiconductor package

Low-cost semiconductor package using conductive metal structure

Heat sink board, manufacturing method thereof, and semiconductor pa...

Semiconductor package having exposed heat sink for high thermal con...

Pressing-type semiconductor power device package

Multilayer clip structure attached to a chip

Press-fit pin, semiconductor package having the same and method for...

Method of bonding terminal of semiconductor chip using solder bump...

Press-fit pin and semiconductor package including the same

Clip structure and semiconductor package using the same

Semiconductor chip package having heat dissipating structure

Clip-bonded semiconductor chip package using metal bumps and method...

Patents Applicationslast 30 patents

ULTRASONIC WELDING SYSTEM AND POWER MODULE PACKAGE FOR POWER CONVER...

METAL CLIP STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

APPARATUS FOR BONDING CLIP, METHOD OF BONDING CLIP, AND SEMICONDUCT...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE HAVING HEAT EMITTING POST BONDED THERETO AND...

BONDING SUBSTRATE, SEMICONDUCTOR PACKAGE HAVING DOUBLE-SIDED SUBSTR...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE MODULE INCLUDING VERTICAL TERMINALS

SEMICONDUCTOR PACKAGE HAVING NEGATIVE PATTERNED SUBSTRATE AND METHO...

SEMICONDUCTOR PACKAGE INCLUDING HEAT RADIATION STRUCTURE, COOLING S...

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE HAVING PACKAGE HOUSING IN ENGRAVED SURFACE FO...

CLIP STRUCTURE FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE...

SEMICONDUCTOR PACKAGE, METHOD OF MANUFACTURING THE SAME AND METAL B...

COOLING SYSTEM WHERE SEMICONDUCTOR COMPONENT COMPRISING SEMICONDUCT...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SYSTEM FOR COOLING SEMICONDUCTOR COMPONENT, METHOD OF MANUFACTURING...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

COUPLED SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

METAL POST, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD OF...

SEMICONDUCTOR PACKAGE

METHOD OF MANUFACTURING SEMICONDUCTOR HAVING DOUBLE-SIDED SUBSTRATE

APPARATUS FOR ATTACHING SEMICONDUCTOR PARTS

PRESSURIZED SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE USING CONDUCTIVE METAL STRUCTURE

Trademarklast 30 trademarks

98081372

98081363 - JMJ KOREA