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Kabushiki Kaisha Shinkawa

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  • Tokyo, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Wire bonding method
    • Patent number 8,678,266
    • Issue date Mar 25, 2014
    • Kabushiki Kaisha Shinkawa
    • Tatsunari Mii
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Ultrasonic horn
    • Patent number 8,511,534
    • Issue date Aug 20, 2013
    • Kabushiki Kaisha Shinkawa
    • Osamu Kakutani
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Ultrasonic horn
    • Patent number 8,434,656
    • Issue date May 7, 2013
    • Kabushiki Kaisha Shinkawa
    • Osamu Kakutani
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wire cleaning guide
    • Patent number 8,283,593
    • Issue date Oct 9, 2012
    • Kabushiki Kaisha Shinkawa
    • Masayuki Horino
    • B08 - CLEANING
  • Information Patent Grant

    Semiconductor device
    • Patent number 8,232,656
    • Issue date Jul 31, 2012
    • Kabushiki Kaisha Shinkawa
    • Tatsunari Mii
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Ultrasonic horn
    • Patent number 8,152,043
    • Issue date Apr 10, 2012
    • Kabushiki Kaisha Shinkawa
    • Osamu Kakutani
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wire bonding method and semiconductor device
    • Patent number 8,143,155
    • Issue date Mar 27, 2012
    • Kabushiki Kaisha Shinkawa
    • Tatsunari Mii
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Ultrasonic horn
    • Patent number 8,052,026
    • Issue date Nov 8, 2011
    • Kabushiki Kaisha Shinkawa
    • Osamu Kakutani
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wire bonding method
    • Patent number 7,934,634
    • Issue date May 3, 2011
    • Kabushiki Kaisha Shinkawa
    • Tatsunari Mii
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Apparatus for detecting press-bonded ball at bonding portion in bon...
    • Patent number 7,929,152
    • Issue date Apr 19, 2011
    • Kabushiki Kaisha Shinkawa
    • Kenji Sugawara
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Method of manufacturing semiconductor device
    • Patent number 7,910,472
    • Issue date Mar 22, 2011
    • Kabushiki Kaisha Shinkawa
    • Tatsunari Mii
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding apparatus and method for cleaning tip of a bonding tool
    • Patent number 7,893,383
    • Issue date Feb 22, 2011
    • Kabushiki Kaisha Shinkawa
    • Kazuo Fujita
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wire bonding apparatus, record medium storing bonding control progr...
    • Patent number 7,857,190
    • Issue date Dec 28, 2010
    • Kabushiki Kaisha Shinkawa
    • Kuniyuki Takahashi
    • Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Information Patent Grant

    Wire bonding method and semiconductor device
    • Patent number 7,851,347
    • Issue date Dec 14, 2010
    • Kabushiki Kaisha Shinkawa
    • Tatsunari Mii
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Imaging device and method for a bonding apparatus
    • Patent number 7,848,022
    • Issue date Dec 7, 2010
    • Kabushiki Kaisha Shinkawa
    • Shigeru Hayata
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Grant

    Bonding apparatus
    • Patent number 7,842,897
    • Issue date Nov 30, 2010
    • Kabushiki Kaisha Shinkawa
    • Toshimichi Miyahara
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor device and wire bonding method
    • Patent number 7,808,116
    • Issue date Oct 5, 2010
    • Kabushiki Kaisha Shinkawa
    • Tatsunari Mii
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Horn attachment arm
    • Patent number 7,780,056
    • Issue date Aug 24, 2010
    • Kabushiki Kaisha Shinkawa
    • Kohei Seyama
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Offset measuring mechanism and offset measuring method in a bonding...
    • Patent number RE41506
    • Issue date Aug 17, 2010
    • Kabushiki Kaisha Shinkawa
    • Manabu Haraguchi
    • 156 - Adhesive bonding and miscellaneous chemical manufacture
  • Information Patent Grant

    Wire bonding apparatus
    • Patent number 7,735,707
    • Issue date Jun 15, 2010
    • Kabushiki Kaisha Shinkawa
    • Kohei Seyama
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wire bonding apparatus, record medium storing bonding control progr...
    • Patent number 7,699,209
    • Issue date Apr 20, 2010
    • Kabushiki Kaisha Shinkawa
    • Shinsuke Tei
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wire bonding apparatus, record medium storing bonding control progr...
    • Patent number 7,686,204
    • Issue date Mar 30, 2010
    • Kabushiki Kaisha Shinkawa
    • Kuniyuki Takahashi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wire bonding method
    • Patent number 7,661,576
    • Issue date Feb 16, 2010
    • Kabushiki Kaisha Shinkawa
    • Tatsunari Mii
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Ball forming device in a bonding apparatus and ball forming method
    • Patent number 7,658,313
    • Issue date Feb 9, 2010
    • Kabushiki Kaisha Shinkawa
    • Shinichi Nishiura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Tail wire cutting method and bonding apparatus
    • Patent number 7,658,314
    • Issue date Feb 9, 2010
    • Kabushiki Kaisha Shinkawa
    • Shinsuke Tei
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Bonding apparatus, ball forming device in said bonding apparatus, a...
    • Patent number 7,644,852
    • Issue date Jan 12, 2010
    • Kabushiki Kaisha Shinkawa
    • Shinichi Nishiura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wire bonding method
    • Patent number 7,621,436
    • Issue date Nov 24, 2009
    • Kabushiki Kaisha Shinkawa
    • Tatsunari Mii
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Semiconductor device
    • Patent number 7,617,966
    • Issue date Nov 17, 2009
    • Kabushiki Kaisha Shinkawa
    • Tatsunari Mii
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Horn-holder pivot type bonding apparatus
    • Patent number 7,578,421
    • Issue date Aug 25, 2009
    • Kabushiki Kaisha Shinkawa
    • Kohei Seyama
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding apparatus and method
    • Patent number 7,576,297
    • Issue date Aug 18, 2009
    • Kabushiki Kaisha Shinkawa
    • Kazuo Fujita
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    Semiconductor device
    • Publication number 20110079904
    • Publication date Apr 7, 2011
    • KABUSHIKI KAISHA SHINKAWA
    • Tatsunari Mii
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Method of manufacturing semiconductor device
    • Publication number 20100248470
    • Publication date Sep 30, 2010
    • KABUSHIKI KAISHA SHINKAWA
    • Tatsunari Mii
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Wire bonding method and semiconductor device
    • Publication number 20100207280
    • Publication date Aug 19, 2010
    • KABUSHIKI KAISHA SHINKAWA
    • Tatsunari Mii
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Wire bonding apparatus, record medium storing bonding control progr...
    • Publication number 20100206849
    • Publication date Aug 19, 2010
    • KABUSHIKI KAISHA SHINKAWA
    • Kuniyuki Takahashi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Wire bonding method
    • Publication number 20100155455
    • Publication date Jun 24, 2010
    • KABUSHIKI KAISHA SHINKAWA
    • Tatsunari Mii
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Wire bonding method and semiconductor device
    • Publication number 20100148369
    • Publication date Jun 17, 2010
    • KABUSHIKI KAISHA SHINKAWA
    • Tatsunari Mii
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Wire bonding apparatus, record medium storing bonding control progr...
    • Publication number 20100133322
    • Publication date Jun 3, 2010
    • KABUSHIKI KAISHA SHINKAWA
    • Kuniyuki Takahashi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Method for securing a curved circuit board in die bonder and record...
    • Publication number 20100078125
    • Publication date Apr 1, 2010
    • KABUSHIKI KAISHA SHINKAWA
    • Noboru Fujino
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Wire bonding apparatus and ball forming method
    • Publication number 20100078464
    • Publication date Apr 1, 2010
    • KABUSHIKI KAISHA SHINKAWA
    • Shinichi Nishiura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Die pickup method
    • Publication number 20100077590
    • Publication date Apr 1, 2010
    • KABUSHIKI KAISHA SHINKAWA
    • Kazuhiro Fujisawa
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Wire bonding method
    • Publication number 20100072262
    • Publication date Mar 25, 2010
    • KABUSHIKI KAISHA SHINKAWA
    • Kenji Sugawara
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Imaging device for a bonding apparatus
    • Publication number 20100067123
    • Publication date Mar 18, 2010
    • KABUSHIKI KAISHA SHINKAWA
    • Shigeru Hayata
    • G02 - OPTICS
  • Information Patent Application

    WIRE BONDING METHOD
    • Publication number 20090308914
    • Publication date Dec 17, 2009
    • KABUSHIKI KAISHA SHINKAWA
    • Tatsunari Mii
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Horn-holder pivot type bonding apparatus
    • Publication number 20090272498
    • Publication date Nov 5, 2009
    • KABUSHIKI KAISHA SHINKAWA
    • Kohei Seyama
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Wire bonding method
    • Publication number 20090194577
    • Publication date Aug 6, 2009
    • KABUSHIKI KAISHA SHINKAWA
    • Tatsunari Mii
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Imaging device and method for a bonding apparatus
    • Publication number 20090124028
    • Publication date May 14, 2009
    • KABUSHIKI KAISHA SHINKAWA
    • Shigeru Hayata
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    Apparatus and method for picking-up semiconductor dies
    • Publication number 20090101282
    • Publication date Apr 23, 2009
    • KABUSHIKI KAISHA SHINKAWA
    • Noboru Fujino
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Apparatus and method for picking-up semiconductor dies
    • Publication number 20090075459
    • Publication date Mar 19, 2009
    • KABUSHIKI KAISHA SHINKAWA
    • Yasushi Sato
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Imaging device and method for a bonding apparatus
    • Publication number 20090059361
    • Publication date Mar 5, 2009
    • KABUSHIKI KAISHA SHINKAWA
    • Shigeru Hayata
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor device and wire bonding method
    • Publication number 20090001608
    • Publication date Jan 1, 2009
    • KABUSHIKI KAISHA SHINKAWA
    • Tatsunari Mii
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Hydrostatic guide system
    • Publication number 20080304772
    • Publication date Dec 11, 2008
    • KABUSHIKI KAISHA SHINKAWA
    • Osamu Kakutani
    • F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
  • Information Patent Application

    Apparatus for detecting press-bonded ball at bonding portion in bon...
    • Publication number 20080259352
    • Publication date Oct 23, 2008
    • KABUSHIKI KAISHA SHINKAWA
    • Kenji Sugawara
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Horn attachment arm
    • Publication number 20080203136
    • Publication date Aug 28, 2008
    • KABUSHIKI KAISHA SHINKAWA
    • Kohei Seyama
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Wire Cleaning Guide
    • Publication number 20080197168
    • Publication date Aug 21, 2008
    • KABUSHIKI KAISHA SHINKAWA
    • Masayuki Horino
    • B08 - CLEANING
  • Information Patent Application

    Semiconductor device and wire bonding method
    • Publication number 20080197510
    • Publication date Aug 21, 2008
    • KABUSHIKI KAISHA SHINKAWA
    • Tatsunari Mii
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Wire bonding and wire bonding method
    • Publication number 20080093416
    • Publication date Apr 24, 2008
    • KABUSHIKI KAISHA SHINKAWA
    • Tetsuya Utano
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Bonding apparatus, ball forming device in said bonding apparatus, a...
    • Publication number 20080035709
    • Publication date Feb 14, 2008
    • KABUSHIKI KAISHA SHINKAWA
    • Shinichi Nishiura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Bonding apparatus and method for cleaning tip of a bonding tool
    • Publication number 20080023028
    • Publication date Jan 31, 2008
    • KABUSHIKI KAISHA SHINKAWA
    • Kazuo Fujita
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Bonding apparatus
    • Publication number 20080023525
    • Publication date Jan 31, 2008
    • KABUSHIKI KAISHA SHINKAWA
    • Toru Maeda
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    Wire bonding apparatus
    • Publication number 20080011809
    • Publication date Jan 17, 2008
    • KABUSHIKI KAISHA SHINKAWA
    • Kohei Seyama
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Trademarklast 30 trademarks