Kanji Otsuka

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Higashiyamato-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor integrated circuit package, printed circuit board, se...
- Patent number 7,906,840
- Issue date Mar 15, 2011
- Kyocera Corporation
- Kanji Otsuka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor circuit device having power and ground lines adapted...
- Patent number 6,625,005
- Issue date Sep 23, 2003
- Kabushiki Kaisha Toshiba
- Kanji Otsuka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Electrostatic discharge protection circuit and terminating resistor...
- Publication number 20080042686
- Publication date Feb 21, 2008
- Kanji OTSUKA
- Kanji Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic circuit device
- Publication number 20040207432
- Publication date Oct 21, 2004
- Kanji Otsuka
- Kanji Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic device
- Publication number 20030090291
- Publication date May 15, 2003
- Kanji Otsuka
- Kanji Otsuka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Trademarklast 30 trademarks