Kasai Koyco Co., Ltd

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Tokyo-to, JP

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Die assembly device for molding laminated assemblies
- Patent number 5,776,509
- Issue date Jul 7, 1998
- Kasai Koyco Co., Ltd
- Tetsuyuki Ota
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

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