Keng-Hung Lin

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Hsinchu County, TW

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Patents Applicationslast 30 patents

Information Patent Application
Pre-molded Cavity 3D Packaging Module with Layout
- Publication number 20130329374
- Publication date Dec 12, 2013
- Keng-Hung Lin
- Keng-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS

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