KING DRAGON INTERNATIONAL INC.

Organization

Tortola, BV

Organizations

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Patents Grantslast 30 patents

Information Patent Grant
Method for forming semiconductor device package with slanting struc...
- Patent number 9,634,180
- Issue date Apr 25, 2017
- King Dragon International Inc.
- Wen Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED package and method of the same
- Patent number 9,117,941
- Issue date Aug 25, 2015
- King Dragon International Inc.
- Wen Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure with die embedded inside and dual build-up laye...
- Patent number 8,304,287
- Issue date Nov 6, 2012
- King Dragon International Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED chip
- Patent number 8,299,488
- Issue date Oct 30, 2012
- King Dragon International Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacking package structure with chip embedded inside and die having...
- Patent number 8,236,608
- Issue date Aug 7, 2012
- King Dragon International Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure with die embedded inside and dual build-up laye...
- Patent number 8,237,257
- Issue date Aug 7, 2012
- King Dragon International Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor package with dual substrates and the method of the same
- Patent number 8,232,633
- Issue date Jul 31, 2012
- King Dragon International Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure with die embedded inside and dual build-up laye...
- Patent number 8,115,297
- Issue date Feb 14, 2012
- King Dragon International Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacking package structure with chip embedded inside and die having...
- Patent number 8,106,504
- Issue date Jan 31, 2012
- King Dragon International Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS

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Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device Package and Method of the Same
- Publication number 20150270239
- Publication date Sep 24, 2015
- King Dragon International Inc.
- Wen Kun Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Device Package and Method of the Same
- Publication number 20150270243
- Publication date Sep 24, 2015
- King Dragon International Inc.
- Wen Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming Semiconductor Device Package with Slanting Struc...
- Publication number 20150111327
- Publication date Apr 23, 2015
- KING DRAGON INTERNATIONAL INC.
- Wen Kun YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED Package with Slanting Structure and Method of the Same
- Publication number 20150099319
- Publication date Apr 9, 2015
- King Dragon International Inc.
- Wen Kun YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED Package and Method of the Same
- Publication number 20150001570
- Publication date Jan 1, 2015
- King Dragon International Inc.
- Wen Kun YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED Package and Method of the Same
- Publication number 20150004727
- Publication date Jan 1, 2015
- King Dragon International Inc.
- Wen Kun YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package with Slanting Structures
- Publication number 20130214418
- Publication date Aug 22, 2013
- King Dragon International Inc.
- Wen Kun YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED Package with Slanting Structure and Method of the Same
- Publication number 20130181227
- Publication date Jul 18, 2013
- KING DRAGON INTERNATIONAL INC.
- Wen Kun YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package with Slanting Structures
- Publication number 20130181351
- Publication date Jul 18, 2013
- KING DRAGON INTERNATIONAL INC.
- Wen Kun YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image Sensor Package with Dual Substrates and the Method of the Same
- Publication number 20120043635
- Publication date Feb 23, 2012
- KING DRAGON INTERNATIONAL INC.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE WITH DIE EMBEDDED INSIDE AND DUAL BUILD-UP LAYE...
- Publication number 20110256714
- Publication date Oct 20, 2011
- King Dragon International Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKING PACKAGE STRUCTURE WITH CHIP EMBEDDED INSIDE AND DIE HAVING...
- Publication number 20110195546
- Publication date Aug 11, 2011
- King Dragon International Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS

KING DRAGON INTERNATIONAL INC.

Organization

Patents Grantslast 30 patents

Method for forming semiconductor device package with slanting struc...

LED package and method of the same

Substrate structure with die embedded inside and dual build-up laye...

LED chip

Stacking package structure with chip embedded inside and die having...

Substrate structure with die embedded inside and dual build-up laye...

Image sensor package with dual substrates and the method of the same

Substrate structure with die embedded inside and dual build-up laye...

Stacking package structure with chip embedded inside and die having...

Patents Applicationslast 30 patents

Semiconductor Device Package and Method of the Same

Semiconductor Device Package and Method of the Same

Method for Forming Semiconductor Device Package with Slanting Struc...

LED Package with Slanting Structure and Method of the Same

LED Package and Method of the Same

LED Package and Method of the Same

Semiconductor Device Package with Slanting Structures

LED Package with Slanting Structure and Method of the Same

Semiconductor Device Package with Slanting Structures

Image Sensor Package with Dual Substrates and the Method of the Same

SUBSTRATE STRUCTURE WITH DIE EMBEDDED INSIDE AND DUAL BUILD-UP LAYE...

STACKING PACKAGE STRUCTURE WITH CHIP EMBEDDED INSIDE AND DIE HAVING...