LEADING INTERCONNECT SEMICONDUCTOR TECHNOLOGY QINHUANGDAO CO., LTD

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QINHUANGDAO, CN

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Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing a packaged circuit structure
- Patent number 11,683,888
- Issue date Jun 20, 2023
- Leading Interconnect Semiconductor Technology Qinhuangdao Co, Ltd.
- Chun-Chieh Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

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Patents Applicationslast 30 patents

Information Patent Application
PACKAGED CIRCUIT STRUCTURE
- Publication number 20230232537
- Publication date Jul 20, 2023
- Leading Interconnect Semiconductor Technology Qinhuangdao Co., Ltd.
- CHUN-CHIEH HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR