Lyontek Inc.

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Hsinchu, TW

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Patents Grantslast 30 patents

Information Patent Grant
Dual-chip package structure
- Patent number 10,438,875
- Issue date Oct 8, 2019
- Lyontek Inc.
- Chi-Cheng Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Read/write control device of resistive type memory
- Patent number 9,607,675
- Issue date Mar 28, 2017
- Lyontek Inc.
- Peng-Ju Huang
- G11 - INFORMATION STORAGE
Information Patent Grant
Split control pad for multiple signal
- Patent number 7,245,028
- Issue date Jul 17, 2007
- Lyontek Inc.
- Chi-Cheng Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacity dividable memory IC
- Patent number 7,190,604
- Issue date Mar 13, 2007
- Lyontek Inc.
- Chi-Cheng Hung
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
DUAL-CHIP PACKAGE STRUCTURE
- Publication number 20190189546
- Publication date Jun 20, 2019
- Lyontek Inc.
- CHI-CHENG HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Memory Collaboration Structure Based on SPI Interface
- Publication number 20180293192
- Publication date Oct 11, 2018
- Lyontek Inc.
- CHI-CHENG HUNG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Dual-Chip Package Structure
- Publication number 20180233487
- Publication date Aug 16, 2018
- Lyontek Inc.
- CHI-CHENG HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Peak Current Bypass Protection Control Device Applicable in MRAM
- Publication number 20170309321
- Publication date Oct 26, 2017
- Lyontek Inc.
- LING-YUEH CHANG
- G11 - INFORMATION STORAGE

Trademarklast 30 trademarks