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Patents Grantslast 30 patents

Information Patent Grant
Silver-containing alloy plating bath and method for electrolytic pl...
- Patent number 9,574,281
- Issue date Feb 21, 2017
- M-TECH JAPAN CO., LTD.
- Kenji Dewaki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Tin-containing alloy plating bath, electroplating method using same...
- Patent number 9,080,247
- Issue date Jul 14, 2015
- SHINJI DEWAKI
- Shinji Dewaki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
SILVER-CONTAINING ALLOY PLATING BATH AND METHOD FOR ELECTROLYTIC PL...
- Publication number 20140238866
- Publication date Aug 28, 2014
- M-TECH JAPAN CO., LTD.
- Kenji Dewaki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TIN-CONTAINING ALLOY PLATING BATH, ELECTROPLATING METHOD USING SAME...
- Publication number 20120208044
- Publication date Aug 16, 2012
- M-TECH JAPAN CO. LTD.
- Shinji Dewaki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SILVER-CONTAINING ALLOY PLATING BATH AND METHOD FOR ELECTROLYTIC PL...
- Publication number 20110293961
- Publication date Dec 1, 2011
- M-TECH JAPAN CO., LTD.
- Kenji Dewaki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

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