Masataka Mizukoshi

Organization

  • Tokyo, JP

Patents Grantslast 30 patents

  • Information Patent Grant

    Electronic component bonding method

    • Patent number 8,915,418
    • Issue date Dec 23, 2014
    • Tadatomo Suga
    • Toshiyuki Shiratori
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR