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MATSUDA SANGYO COMPANY LIMITED

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  • Tokyo, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Palladium plating solution
    • Patent number 6,811,674
    • Issue date Nov 2, 2004
    • Matsuda Sangyo Co., Ltd.
    • Shinji Ueki
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    NOBLE METAL VAPOR DEPOSITION MATERIAL
    • Publication number 20250115990
    • Publication date Apr 10, 2025
    • MATSUDA SANGYO COMPANY LIMITED
    • Takahiro KOBAYASHI
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME
    • Publication number 20100089613
    • Publication date Apr 15, 2010
    • MATSUDA SANGYO CO., LTD.
    • Mamoru Takayanagi
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Palladium plating solution
    • Publication number 20020144909
    • Publication date Oct 10, 2002
    • MATSUDA SANGYO CO., LTD.
    • Shinji Ueki
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Trademarklast 30 trademarks