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MEI WET PROCESSING SYSTEMS & SERVICES LLC

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  • ALBANY, OR, US
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Patents Grantslast 30 patents

  • Information Patent Grant

    Wafer dryer apparatus and method
    • Patent number 10,473,396
    • Issue date Nov 12, 2019
    • MEI Wet Processing Systems & Services LLC
    • Scott Tice
    • F26 - DRYING