MEMSensing Microsystems (Suzhou, China) Co., Ltd.

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Suzhou City, CN

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Patents Grantslast 30 patents

Information Patent Grant
Bulk acoustic wave resonator and fabrication method for the bulk ac...
- Patent number 12,323,120
- Issue date Jun 3, 2025
- MEMSensing Microsystems (Suzhou, China) Co., Ltd.
- Ping Lv
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Package structure for differential pressure sensor, and electronic...
- Patent number 12,092,540
- Issue date Sep 17, 2024
- MEMSENSING MICROSYSTEMS (SUZHOU, CHINA) CO. LTD.
- Gang Li
- G01 - MEASURING TESTING
Information Patent Grant
Differential condenser microphone with double vibrating membranes
- Patent number 11,553,282
- Issue date Jan 10, 2023
- MEMSENSING MICROSYSTEMS (SUZHOU, CHINA) CO. LTD.
- Kai Sun
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Capacitive micro-electro-mechanical system microphone and method fo...
- Patent number 9,888,324
- Issue date Feb 6, 2018
- Memsensing Microsystems (Suzhou, China) Co., Ltd.
- Wei Hu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Pressure sensor and packaging method thereof
- Patent number 9,546,089
- Issue date Jan 17, 2017
- Memsensing Microsystems Co., Ltd.
- Wei Hu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated chip with micro-electro-mechanical system and integrated...
- Patent number 9,334,159
- Issue date May 10, 2016
- MEMSENSING MICROSYSTEMS (SUZHOU, CHINA) CO., LTD.
- Gang Li
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package for micro-electro-mechanical acoustic transducer with impro...
- Patent number 8,472,647
- Issue date Jun 25, 2013
- Memsensing Microsystems Co., Ltd.
- Jia-Xin Mei
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
AIRFLOW SENSOR AND AIRFLOW SENSOR PACKAGING STRUCTURE
- Publication number 20250100872
- Publication date Mar 27, 2025
- MEMSensing Microsystems (Suzhou, China) Co., Ltd.
- Yanzi MENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
AIRFLOW SENSOR AND AIRFLOW SENSOR PACKAGING STRUCTURE
- Publication number 20250102335
- Publication date Mar 27, 2025
- MEMSensing Microsystems (Suzhou, China) Co., Ltd.
- Yanzi MENG
- G01 - MEASURING TESTING
Information Patent Application
AIRFLOW SENSOR AND AIRFLOW SENSOR PACKAGING STRUCTURE
- Publication number 20250102535
- Publication date Mar 27, 2025
- MEMSensing Microsystems (Suzhou, China) Co., Ltd.
- Yanzi MENG
- G01 - MEASURING TESTING
Information Patent Application
MICRO-ELECTROMECHANICAL SYSTEM (MEMS) STRUCTURE AND MEMS MICROPHONE...
- Publication number 20250059024
- Publication date Feb 20, 2025
- MEMSENSING MICROSYSTEMS (SUZHOU, CHINA) CO., LTD.
- Genlan RONG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE STRUCTURE FOR DIFFERENTIAL PRESSURE SENSOR, AND ELECTRONIC...
- Publication number 20220026299
- Publication date Jan 27, 2022
- Memsensing Microsystems (Suzhou, China) Co. Ltd.
- Gang LI
- G01 - MEASURING TESTING
Information Patent Application
Bulk Acoustic Wave Resonator and Fabrication Method for the Bulk Ac...
- Publication number 20210313946
- Publication date Oct 7, 2021
- MEMSensing Microsystems (Suzhou, China) Co., Ltd.
- Ping LV
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
DIFFERENTIAL CONDENSER MICROPHONE WITH DOUBLE VIBRATING MEMBRANES
- Publication number 20200186940
- Publication date Jun 11, 2020
- Memsensing Microsystems (Suzhou, China) Co. Ltd.
- Kai SUN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MICRO-SILICON MICROPHONE AND FABRICATION METHOD THEREOF
- Publication number 20180146300
- Publication date May 24, 2018
- MEMSensing Microsystems (Suzhou, China) Co., Ltd.
- Kai SUN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Pressure Sensor and Packaging Method Thereof
- Publication number 20170036907
- Publication date Feb 9, 2017
- MEMSensing Microsystems Co., Ltd.
- Wei HU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CAPACITIVE MICRO-ELECTRO-MECHANICAL SYSTEM MICROPHONE AND METHOD FO...
- Publication number 20160088402
- Publication date Mar 24, 2016
- MEMSensing Microsystems (Suzhou, China) Co., Ltd.
- Wei HU
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
INTEGRATED CHIP WITH MICRO-ELECTRO-MECHANICAL SYSTEM AND INTEGRATED...
- Publication number 20140332909
- Publication date Nov 13, 2014
- MEMSensing Microsystems (Suzhou, China) Co., Ltd.
- Gang Li
- B81 - MICRO-STRUCTURAL TECHNOLOGY

MEMSensing Microsystems (Suzhou, China) Co., Ltd.

Organization

Patents Grantslast 30 patents

Bulk acoustic wave resonator and fabrication method for the bulk ac...

Package structure for differential pressure sensor, and electronic...

Differential condenser microphone with double vibrating membranes

Capacitive micro-electro-mechanical system microphone and method fo...

Pressure sensor and packaging method thereof

Integrated chip with micro-electro-mechanical system and integrated...

Package for micro-electro-mechanical acoustic transducer with impro...

Patents Applicationslast 30 patents

AIRFLOW SENSOR AND AIRFLOW SENSOR PACKAGING STRUCTURE

AIRFLOW SENSOR AND AIRFLOW SENSOR PACKAGING STRUCTURE

AIRFLOW SENSOR AND AIRFLOW SENSOR PACKAGING STRUCTURE

MICRO-ELECTROMECHANICAL SYSTEM (MEMS) STRUCTURE AND MEMS MICROPHONE...

PACKAGE STRUCTURE FOR DIFFERENTIAL PRESSURE SENSOR, AND ELECTRONIC...

Bulk Acoustic Wave Resonator and Fabrication Method for the Bulk Ac...

DIFFERENTIAL CONDENSER MICROPHONE WITH DOUBLE VIBRATING MEMBRANES

MICRO-SILICON MICROPHONE AND FABRICATION METHOD THEREOF

Pressure Sensor and Packaging Method Thereof

CAPACITIVE MICRO-ELECTRO-MECHANICAL SYSTEM MICROPHONE AND METHOD FO...

INTEGRATED CHIP WITH MICRO-ELECTRO-MECHANICAL SYSTEM AND INTEGRATED...

Trademarklast 30 trademarks