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Jiangsu, CN
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Patents Grants
last 30 patents
Information
Patent Grant
Method for wafer-level chip scale package testing
Patent number
9,676,619
Issue date
Jun 13, 2017
MEMSIC SEMICONDUCTOR (WUXI) CO., LTD.
Yang Zhao
B81 - MICRO-STRUCTURAL TECHNOLOGY
Patents Applications
last 30 patents
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Patent Application
Magnetic Field Sensor With Three-Dimensional Spiral Reset Coil
Publication number
20170115363
Publication date
Apr 27, 2017
Memsic Semiconductor (Wuxi) Co., Ltd.
Leyue Jiang
G01 - MEASURING TESTING
Information
Patent Application
Method For Wafer-Level Chip Scale Package Testing
Publication number
20170113929
Publication date
Apr 27, 2017
Memsic Semiconductor (Wuxi) Co., Ltd.
Yang Zhao
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
Magnetic Field Sensor With Integrated Self-Test Reset Wire
Publication number
20170115360
Publication date
Apr 27, 2017
Memsic Semiconductor (Wuxi) Co., Ltd.
Leyue Jiang
G01 - MEASURING TESTING
Information
Patent Application
Anisotropic Magnetoresistance Sensor
Publication number
20160313412
Publication date
Oct 27, 2016
Memsic Semiconductor (Wuxi) Co., Ltd.
Dalai Li
G01 - MEASURING TESTING
Information
Patent Application
COMPOSITE GAS FLUID FLOW MEASURING METHOD AND ITS DEVICE
Publication number
20110125424
Publication date
May 26, 2011
MEMSIC SEMICONDUCTOR (WUXI) CO., LTD.
Huaicheng Han
G01 - MEASURING TESTING
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