Micro Components Ltd.

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Migdal IIa'emek, IL

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Patents Grantslast 30 patents

Information Patent Grant
Device for electronic packaging, pin jig fixture
- Patent number 6,670,704
- Issue date Dec 30, 2003
- Micro Components Ltd.
- Shimon Neftin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate for electronic packaging, pin jig fixture
- Patent number 6,448,510
- Issue date Sep 10, 2002
- Micro Components Ltd.
- Shimon Neftin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
MICROELECTRONIC INTERCONNECT SUBSTRATE AND PACKAGING TECHNIQUES
- Publication number 20120112238
- Publication date May 10, 2012
- MICRO COMPONENTS LTD.
- Uri Mirsky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERCONNECT SUBSTRATES, METHODS AND SYSTEMS THEREOF
- Publication number 20100252306
- Publication date Oct 7, 2010
- Micro Components Ltd.
- Uri Mirsky
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Trademarklast 30 trademarks