Micro Processing Technology, Inc.

Organization

Lafayette, CA, US

Organizations

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
System for separating devices from a semiconductor wafer
- Patent number 9,153,493
- Issue date Oct 6, 2015
- Micro Processing Technology, Inc.
- Paul C. Lindsey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method using fluid pressure to remove back metal from semiconductor...
- Patent number 8,906,745
- Issue date Dec 9, 2014
- Micro Processing Technology, Inc.
- Paul C. Lindsey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of removing back metal from an etched semiconductor scribe s...
- Patent number 8,450,188
- Issue date May 28, 2013
- Micro Processing Technology, Inc.
- Paul C. Lindsey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for breaking a semiconductor wafer or other workpiece along...
- Patent number 8,220,685
- Issue date Jul 17, 2012
- Micro Processing Technology, Inc.
- Paul C. Lindsey, Jr.
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Grant
Method and apparatus for improving force control in wafer scribing
- Patent number 7,807,479
- Issue date Oct 5, 2010
- Micro Processing Technology, Inc.
- Paul C. Lindsey, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scribing system with particle remover
- Patent number 7,415,916
- Issue date Aug 26, 2008
- Micro Processing Technology, Inc.
- Paul C. Lindsey, Jr.
- B27 - WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL NAILING OR STAPLING MACH...
Information Patent Grant
Scribing tool and method
- Patent number 7,392,732
- Issue date Jul 1, 2008
- Micro Processing Technology, Inc.
- Paul C. Lindsey, Jr.
- B27 - WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL NAILING OR STAPLING MACH...
Information Patent Grant
Apparatus and method for scribing a semiconductor wafer while contr...
- Patent number 7,165,331
- Issue date Jan 23, 2007
- Micro Processing Technology, Inc.
- Paul C. Lindsey, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer scribing system
- Patent number 6,826,840
- Issue date Dec 7, 2004
- Micro Processing Technology, Inc.
- Paul C. Lindsey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating an integrated circuit
- Patent number 6,022,807
- Issue date Feb 8, 2000
- Micro Processing Technology, Inc.
- Paul C. Lindsey
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
Scribing tool and method
- Publication number 20060162172
- Publication date Jul 27, 2006
- MICRO PROCESSING TECHNOLOGY, INC.
- Paul C. Lindsey
- B27 - WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL NAILING OR STAPLING MACH...
Information Patent Application
Scribing system with particle remover
- Publication number 20060162173
- Publication date Jul 27, 2006
- MICRO PROCESSING TECHNOLOGY, INC.
- Paul C. Lindsey
- B27 - WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL NAILING OR STAPLING MACH...

Micro Processing Technology, Inc.

Organization

Patents Grantslast 30 patents

System for separating devices from a semiconductor wafer

Method using fluid pressure to remove back metal from semiconductor...

Method of removing back metal from an etched semiconductor scribe s...

System for breaking a semiconductor wafer or other workpiece along...

Method and apparatus for improving force control in wafer scribing

Scribing system with particle remover

Scribing tool and method

Apparatus and method for scribing a semiconductor wafer while contr...

Semiconductor wafer scribing system

Method for fabricating an integrated circuit

Patents Applicationslast 30 patents

Scribing tool and method

Scribing system with particle remover

Trademarklast 30 trademarks