Microelectronic Packaging Inc.

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Scottsdale, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
High energy multilayer ceramic capacitor
- Patent number 5,808,856
- Issue date Sep 15, 1998
- Microelectronic Packaging, Inc.
- William P. Bischoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a multilayer ceramic capacitor
- Patent number 5,680,685
- Issue date Oct 28, 1997
- Microelectronic Packaging, Inc.
- William P. Bischoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a high energy multilayer ceramic capacitor
- Patent number 5,603,147
- Issue date Feb 18, 1997
- Microelectronic Packaging, Inc.
- William P. Bischoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Glass bonding method
- Patent number 5,013,347
- Issue date May 7, 1991
- Microelectronic Packaging Inc.
- Chew E. Seng
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES

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Trademarklast 30 trademarks

Information Trademark
75763624 - MELTRONIX
- Serial number 75763624
- Filing date Jul 29, 1999
- Microelectronic Packaging, Inc.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
74112362 - SUPERSEAL
- Serial number 74112362
- Registration number 1788714
- Filing date Nov 5, 1990
- MICROELECTRONIC PACKAGING, INC.
- 1 - Chemicals used in industry, science and photography, as well as in agriculture, horticulture and forestry