TREA

Microelectronics Assembly Technologies, Inc.

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Organization

  • Research Triangle Park, NC, US
Organizations

Patents Grantslast 30 patents

  • Information Patent Grant

    Rigid circuit board with flexibly attached module
    • Patent number 9,746,879
    • Issue date Aug 29, 2017
    • Microelectronics Assembly Technologies, Inc.
    • James E. Clayton
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Grant

    Method for making an electrical circuit
    • Patent number 9,338,895
    • Issue date May 10, 2016
    • Microelectronics Assembly Technologies
    • James E. Clayton
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Electronic interconnect system
    • Patent number 8,902,606
    • Issue date Dec 2, 2014
    • Microelectronics Assembly Technologies
    • James E. Clayton
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Grant

    Compression connector system
    • Patent number 8,899,994
    • Issue date Dec 2, 2014
    • Microelectronics Assembly Technologies, Inc.
    • James E. Clayton
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Electronic module with heat spreading enclosure
    • Patent number 8,837,141
    • Issue date Sep 16, 2014
    • Microelectronics Assembly Technologies
    • James E. Clayton
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Pierced flexible circuit and compression joint
    • Patent number 8,834,182
    • Issue date Sep 16, 2014
    • Microelectronics Assembly Technologies
    • James E. Clayton
    • Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Information Patent Grant

    Flexible circuit board and connection system
    • Patent number 8,817,458
    • Issue date Aug 26, 2014
    • Microelectronics Assembly Technologies, Inc.
    • James E. Clayton
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Electrical connector and method of making
    • Patent number 8,692,124
    • Issue date Apr 8, 2014
    • Microelectronics Assembly Technologies
    • James E. Clayton
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Thin multi-chip flex module
    • Patent number 8,559,181
    • Issue date Oct 15, 2013
    • Microelectronics Assembly Technologies, Inc.
    • James E. Clayton
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Thin multi-chip flex module
    • Patent number 8,345,431
    • Issue date Jan 1, 2013
    • Microelectronics Assembly Technologies, Inc.
    • James E. Clayton
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Thin multi-chip flex module
    • Patent number RE42252
    • Issue date Mar 29, 2011
    • Microelectronics Assembly Technologies, Inc.
    • James E. Clayton
    • 361 - Electricity: electrical systems and devices
  • Information Patent Grant

    Thin multi-chip flex module
    • Patent number 7,796,399
    • Issue date Sep 14, 2010
    • Microelectronics Assembly Technologies, Inc.
    • James E. Clayton
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Thin multichip flex-module
    • Patent number 7,787,254
    • Issue date Aug 31, 2010
    • Microelectronics Assembly Technologies, Inc.
    • James E. Clayton
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Thin multi-chip flex module
    • Patent number 7,724,530
    • Issue date May 25, 2010
    • Microelectronics Assembly Technologies, Inc.
    • James E. Clayton
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Thin multichip flex-module
    • Patent number 7,520,781
    • Issue date Apr 21, 2009
    • Microelectronics Assembly Technologies
    • James E. Clayton
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Thin multichip flex-module
    • Patent number 7,429,788
    • Issue date Sep 30, 2008
    • Microelectronics Assembly Technologies, Inc.
    • James E. Clayton
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Thin multichip flex-module
    • Patent number 7,393,226
    • Issue date Jul 1, 2008
    • Microelectronics Assembly Technologies, Inc.
    • James E. Clayton
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Thin multichip flex-module
    • Patent number 7,394,149
    • Issue date Jul 1, 2008
    • Microelectronics Assembly Technologies, Inc.
    • James E. Clayton
    • G06 - COMPUTING CALCULATING COUNTING