MICROSEMI SEMICONDUCTOR LIMITED

Organization

Newport, GB

Organizations

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Embedded circuit package
- Patent number 9,698,124
- Issue date Jul 4, 2017
- Microsemi Semiconductor Limited
- Piers Tremlett
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Timing source
- Patent number 8,861,501
- Issue date Oct 14, 2014
- Microsemi Semiconductor Limited
- Martin Richard Crowle
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Integrated circuit package
- Patent number 8,829,684
- Issue date Sep 9, 2014
- Microsemi Semiconductor Limited
- Piers Tremlett
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with discrete components surface mounted...
- Patent number 8,643,192
- Issue date Feb 4, 2014
- Microsemi Semiconductor Limited
- Piers Tremlett
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power supply control circuit, power supply and body implant
- Patent number 8,145,312
- Issue date Mar 27, 2012
- Microsemi Semiconductor Limited
- Tracy Wotherspoon
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE

Patents Applicationslast 30 patents

Information Patent Application
Chemical Vapor Deposition Diamond (CVDD) Wires for Thermal Transport
- Publication number 20210143080
- Publication date May 13, 2021
- Microsemi Semiconductor Limited
- Philip Andrew Swire
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Flipped-Conductor-Patch Lamination for Ultra Fine-Line Substrate Cr...
- Publication number 20210092842
- Publication date Mar 25, 2021
- Microsemi Semiconductor Limited
- John Adam Tracy deMercleden Smithells
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Board Assembly with Chemical Vapor Deposition Diamond (CVDD) Window...
- Publication number 20210035883
- Publication date Feb 4, 2021
- Microsemi Semiconductor Limited
- Philip Andrew Swire
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flipped-Conductor-Patch Lamination for Ultra Fine-Line Substrate Cr...
- Publication number 20200120797
- Publication date Apr 16, 2020
- Microsemi Semiconductor Limited
- John Adam Tracy deMercleden Smithells
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Embedded Circuit Package
- Publication number 20160260685
- Publication date Sep 8, 2016
- Microsemi Semiconductor Limited
- Piers Tremlett
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE
- Publication number 20140070421
- Publication date Mar 13, 2014
- MICROSEMI SEMICONDUCTOR LIMITED
- Piers Tremlett
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE
- Publication number 20120292781
- Publication date Nov 22, 2012
- MICROSEMI SEMICONDUCTOR LIMITED
- Piers Tremlett
- H01 - BASIC ELECTRIC ELEMENTS

MICROSEMI SEMICONDUCTOR LIMITED

Organization

Patents Grantslast 30 patents

Embedded circuit package

Timing source

Integrated circuit package

Integrated circuit package with discrete components surface mounted...

Power supply control circuit, power supply and body implant

Patents Applicationslast 30 patents

Chemical Vapor Deposition Diamond (CVDD) Wires for Thermal Transport

Flipped-Conductor-Patch Lamination for Ultra Fine-Line Substrate Cr...

Board Assembly with Chemical Vapor Deposition Diamond (CVDD) Window...

Flipped-Conductor-Patch Lamination for Ultra Fine-Line Substrate Cr...

Embedded Circuit Package

INTEGRATED CIRCUIT PACKAGE

INTEGRATED CIRCUIT PACKAGE

Trademarklast 30 trademarks