MUTUAL-TEK INDUSTRIES CO., LTD.

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Xinzhaung City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board and method thereof
- Patent number 9,526,179
- Issue date Dec 20, 2016
- MUTUAL-TEK INDUSTRIES CO., LTD.
- Chiu Yu Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a combined circuit board
- Patent number 9,433,098
- Issue date Aug 30, 2016
- Mutual-Tek Industries Co., Ltd.
- Shi Yu Chiou
- B32 - LAYERED PRODUCTS
Information Patent Grant
Packaged structure having magnetic component and method thereof
- Patent number 8,581,114
- Issue date Nov 12, 2013
- PlanarMag, Inc.
- William Lee Harrison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing process of embedded type flexible or rigid printed ci...
- Patent number 7,892,412
- Issue date Feb 22, 2011
- Mutual-Tek Industries Co., Ltd
- Roger Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming a molded circuit board
- Patent number 7,676,918
- Issue date Mar 16, 2010
- Mutual-Tek Industries Co., Ltd
- Jung-Chien Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a combined multilayer circuit board having...
- Patent number 7,603,771
- Issue date Oct 20, 2009
- Mutual-Tek Industries Co., Ltd.
- Roger Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminated bond of multilayer circuit board having embedded chips
- Patent number 7,505,282
- Issue date Mar 17, 2009
- Mutual-TEK Industries Co., Ltd.
- Roger Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

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Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD THEREOF
- Publication number 20150257267
- Publication date Sep 10, 2015
- MUTUAL-TEK INDUSTRIES CO., LTD.
- Chiu Yu CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMBINED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140353014
- Publication date Dec 4, 2014
- MUTUAL-TEK INDUSTRIES CO., LTD.
- Wen-Chin Lai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE SUBSTRATE AND ELECTRONIC ASSEMBLY
- Publication number 20140168899
- Publication date Jun 19, 2014
- MUTUAL-TEK INDUSTRIES CO., LTD.
- Chih Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A COMBINED CIRCUIT BOARD
- Publication number 20130292050
- Publication date Nov 7, 2013
- MUTUAL-TEK INDUSTRIES CO., LTD.
- Shi Yu Chiou
- B32 - LAYERED PRODUCTS
Information Patent Application
MULTILAYER CIRCUIT BOARD
- Publication number 20120314390
- Publication date Dec 13, 2012
- MUTUAL-TEK INDUSTRIES CO., LTD.
- Jung-Chien Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMBINED MULTILAYER CIRCUIT BOARD HAVING EMBEDDED COMPONENTS AND MA...
- Publication number 20110216514
- Publication date Sep 8, 2011
- MUTUAL-TEK INDUSTRIES CO., LTD.
- Jung-Chien Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERCONNECTION STRUCTURE AND METHOD THEREOF
- Publication number 20110168438
- Publication date Jul 14, 2011
- MUTUAL-TEK INDUSTRIES CO., LTD.
- Jung-Chien Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT EMITTING APPARATUS AND METHOD FOR THE SAME
- Publication number 20100276718
- Publication date Nov 4, 2010
- MUTUAL-TEK INDUSTRIES CO., LTD.
- Jung-Chien Chang
- G02 - OPTICS
Information Patent Application
PRINTED CIRCUIT BOARD WITH EMBEDDED ELECTRONIC COMPONENTS AND METHO...
- Publication number 20090266596
- Publication date Oct 29, 2009
- MUTUAL-TEK INDUSTRIES CO., LTD.
- Jung-Chien Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT EMITTING APPARATUS AND METHOD FOR THE SAME
- Publication number 20090061552
- Publication date Mar 5, 2009
- MUTUAL-TEK INDUSTRIES CO., LTD.
- Jung-Chien Chang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
INTERCONNECTION STRUCTURE AND METHOD THEREOF
- Publication number 20080230264
- Publication date Sep 25, 2008
- MUTUAL-TEK INDUSTRIES CO., LTD.
- Jung-Chien Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT EMITTING APPARATUS AND METHOD FOR THE SAME
- Publication number 20080064131
- Publication date Mar 13, 2008
- MUTUAL-TEK INDUSTRIES CO., LTD.
- Jung-Chien Chang
- G02 - OPTICS
Information Patent Application
MOLDED CIRCUIT BOARD AND METHOD FOR THE SAME
- Publication number 20080012154
- Publication date Jan 17, 2008
- MUTUAL-TEK INDUSTRIES CO., LTD.
- Jung-Chien Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING PROCESS OF EMBEDDED TYPE FLEXIBLE OR RIGID PRINTED CI...
- Publication number 20070295606
- Publication date Dec 27, 2007
- MUTUAL-TEK INDUSTRIES CO., LTD.
- Roger Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

MUTUAL-TEK INDUSTRIES CO., LTD.

Organization

Patents Grantslast 30 patents

Printed circuit board and method thereof

Method of manufacturing a combined circuit board

Packaged structure having magnetic component and method thereof

Manufacturing process of embedded type flexible or rigid printed ci...

Method for forming a molded circuit board

Method of manufacturing a combined multilayer circuit board having...

Laminated bond of multilayer circuit board having embedded chips

Patents Applicationslast 30 patents

PRINTED CIRCUIT BOARD AND METHOD THEREOF

COMBINED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

PACKAGE SUBSTRATE AND ELECTRONIC ASSEMBLY

METHOD OF MANUFACTURING A COMBINED CIRCUIT BOARD

MULTILAYER CIRCUIT BOARD

COMBINED MULTILAYER CIRCUIT BOARD HAVING EMBEDDED COMPONENTS AND MA...

INTERCONNECTION STRUCTURE AND METHOD THEREOF

LIGHT EMITTING APPARATUS AND METHOD FOR THE SAME

PRINTED CIRCUIT BOARD WITH EMBEDDED ELECTRONIC COMPONENTS AND METHO...

LIGHT EMITTING APPARATUS AND METHOD FOR THE SAME

INTERCONNECTION STRUCTURE AND METHOD THEREOF

LIGHT EMITTING APPARATUS AND METHOD FOR THE SAME

MOLDED CIRCUIT BOARD AND METHOD FOR THE SAME

MANUFACTURING PROCESS OF EMBEDDED TYPE FLEXIBLE OR RIGID PRINTED CI...