National Center for Advanced Packaging Co., Ltd.

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Wuxi, CN

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor cleaning equipment and method for cleaning through vi...
- Patent number 11,854,794
- Issue date Dec 26, 2023
- NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD.
- Daping Yao
- B08 - CLEANING
Information Patent Grant
Radar component package and method for manufacturing the same
- Patent number 11,346,920
- Issue date May 31, 2022
- National Center for Advanced Packaging Co., Ltd.
- Wenqi Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Active optical adapter plate and optical interconnection module
- Patent number 10,209,467
- Issue date Feb 19, 2019
- National Center for Advanced Packaging Co., Ltd.
- Haiyun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for constructing an external circuit structure
- Patent number 10,015,889
- Issue date Jul 3, 2018
- NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD.
- Zhongyao Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing fan out wafer level package
- Patent number 9,773,684
- Issue date Sep 26, 2017
- National Center for Advanced Packaging Co., Ltd.
- Hongjie Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation solution for advanced chip packages
- Patent number 9,653,378
- Issue date May 16, 2017
- National Center for Advanced Packaging Co., Ltd.
- Fengze Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical communication apparatus and method of assembling the same
- Patent number 9,638,875
- Issue date May 2, 2017
- National Center for Advanced Packaging Co., Ltd.
- Daniel Guidotti
- G02 - OPTICS
Information Patent Grant
Method for polishing a polymer surface
- Patent number 9,589,786
- Issue date Mar 7, 2017
- National Center for Advanced Packaging Co., Ltd.
- Ting Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip embedded package method and structure
- Patent number 9,583,418
- Issue date Feb 28, 2017
- National Center for Advanced Packaging Co., Ltd.
- Xueping Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanical debonding method and system
- Patent number 9,368,376
- Issue date Jun 14, 2016
- National Center for Advanced Packaging Co., Ltd.
- Daquan Yu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Oblique angle optical fiber assembly
- Patent number 9,316,793
- Issue date Apr 19, 2016
- NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD.
- Daniel Guidotti
- G02 - OPTICS
Information Patent Grant
Method for removing electroplated metal facets and reusing a barrie...
- Patent number 9,293,368
- Issue date Mar 22, 2016
- NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD.
- Kai Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for fabricating fine-pitch micro-bumps
- Patent number 9,177,929
- Issue date Nov 3, 2015
- NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD.
- Wenqi Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TSV backside reveal structure and exposing process
- Patent number 9,076,699
- Issue date Jul 7, 2015
- National Center for Advanced Packaging Co., Ltd.
- Wenqi Zhang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGING STRUCTURE AND PREPARATION METHOD THEREFOR
- Publication number 20240203865
- Publication date Jun 20, 2024
- NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD.
- Quanlong WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSING CHIP PACKAGING STRUCTURE AND METHOD
- Publication number 20240186200
- Publication date Jun 6, 2024
- NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD.
- Peng SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE FOR REDUCING WARPAGE OF PLASTIC PACKAGE WAFER AND...
- Publication number 20240071873
- Publication date Feb 29, 2024
- NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD.
- Liqiang CAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL CHIP STRUCTURE, MULTIPLE-CHIP STACKED AND INTERCONNECTE...
- Publication number 20230091513
- Publication date Mar 23, 2023
- SHANGHAI XIANFANG SEMICONDUCTOR CO., LTD.
- Liqiang CAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT ENCAPSULATION STRUCTURE AND ENCAPSULATION METHOD FOR CHIP
- Publication number 20220115356
- Publication date Apr 14, 2022
- National Center for Advanced Packaging Co., Ltd.
- Peng SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CLEANING EQUIPMENT AND METHOD FOR CLEANING THROUGH VI...
- Publication number 20210296115
- Publication date Sep 23, 2021
- NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD.
- Daping YAO
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
A STRESS SENSOR STRUCTURE AND A MANUFACTURING METHOD THEREOF
- Publication number 20210223122
- Publication date Jul 22, 2021
- National Center for Advanced Packaging Co., Ltd.
- Wen Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADAR COMPONENT PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210181297
- Publication date Jun 17, 2021
- National Center for Advanced Packaging Co., Ltd.
- Wenqi Zhang
- G01 - MEASURING TESTING
Information Patent Application
ACTIVE OPTICAL ADAPTER PLATE AND OPTICAL INTERCONNECTION MODULE
- Publication number 20180136421
- Publication date May 17, 2018
- National Center for Advanced Packaging Co., Ltd.
- Haiyun XUE
- G02 - OPTICS
Information Patent Application
FLEXIBLE-SUBSTRATE-BASED THREE-DIMENSIONAL PACKAGING STRUCTURE AND...
- Publication number 20160293573
- Publication date Oct 6, 2016
- Institute of Microelectronics, Chinese Academy of Sciences
- Xueping Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optical communication apparatus and method of assembling the same
- Publication number 20160274320
- Publication date Sep 22, 2016
- NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD.
- Daniel Guidotti
- G02 - OPTICS
Information Patent Application
METHOD OF MANUFACTURING FAN OUT WAFER LEVEL PACKAGE
- Publication number 20160218020
- Publication date Jul 28, 2016
- National Center for Advanced Packaging Co., Ltd.
- Hongjie WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION SOLUTION FOR ADVANCED CHIP PACKAGES
- Publication number 20160037680
- Publication date Feb 4, 2016
- National Center for Advanced Packaging Co., Ltd.
- Fengze Hou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Polishing a Polymer Surface
- Publication number 20150311093
- Publication date Oct 29, 2015
- NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD.
- Ting LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OBLIQUE ANGLE OPTICAL FIBER ASSEMBLY
- Publication number 20150212277
- Publication date Jul 30, 2015
- National Center for Advanced Packaging Co., Ltd.
- Daniel Guidotti
- G02 - OPTICS
Information Patent Application
Method for Constructing an External Circuit structure
- Publication number 20150096173
- Publication date Apr 9, 2015
- NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD.
- Zhongyao Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TSV Wafer Thinning Controlling Method and System
- Publication number 20150099423
- Publication date Apr 9, 2015
- NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD.
- Feng JIANG
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR REMOVING ELECTROPLATED METAL FACETS AND REUSING A BARRIE...
- Publication number 20150072516
- Publication date Mar 12, 2015
- National Center for Advanced Packaging Co., Ltd.
- Kai Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fine Pitch stud POP Structure and Method
- Publication number 20150035147
- Publication date Feb 5, 2015
- NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD.
- Jiangang LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Techniques for Fabricating Fine-Pitch Micro-Bumps
- Publication number 20140342545
- Publication date Nov 20, 2014
- National Center for Advanced Packaging Co., Ltd.
- Wenqi Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TSV Backside Reveal Structure and Exposing Process
- Publication number 20140327132
- Publication date Nov 6, 2014
- National Center for Advanced Packaging (NCAP China)
- Wenqi ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TSV Backside Reveal Structure and Exposing Process
- Publication number 20140329381
- Publication date Nov 6, 2014
- National Center for Advanced Packaging (NCAP China)
- Wenqi ZHANG
- H01 - BASIC ELECTRIC ELEMENTS

National Center for Advanced Packaging Co., Ltd.

Organization

Patents Grantslast 30 patents

Semiconductor cleaning equipment and method for cleaning through vi...

Radar component package and method for manufacturing the same

Active optical adapter plate and optical interconnection module

Method for constructing an external circuit structure

Method of manufacturing fan out wafer level package

Heat dissipation solution for advanced chip packages

Optical communication apparatus and method of assembling the same

Method for polishing a polymer surface

Chip embedded package method and structure

Mechanical debonding method and system

Oblique angle optical fiber assembly

Method for removing electroplated metal facets and reusing a barrie...

Techniques for fabricating fine-pitch micro-bumps

TSV backside reveal structure and exposing process

Patents Applicationslast 30 patents

CHIP PACKAGING STRUCTURE AND PREPARATION METHOD THEREFOR

SENSING CHIP PACKAGING STRUCTURE AND METHOD

PACKAGE STRUCTURE FOR REDUCING WARPAGE OF PLASTIC PACKAGE WAFER AND...

WAFER-LEVEL CHIP STRUCTURE, MULTIPLE-CHIP STACKED AND INTERCONNECTE...

FAN-OUT ENCAPSULATION STRUCTURE AND ENCAPSULATION METHOD FOR CHIP

SEMICONDUCTOR CLEANING EQUIPMENT AND METHOD FOR CLEANING THROUGH VI...

A STRESS SENSOR STRUCTURE AND A MANUFACTURING METHOD THEREOF

RADAR COMPONENT PACKAGE AND METHOD FOR MANUFACTURING THE SAME

ACTIVE OPTICAL ADAPTER PLATE AND OPTICAL INTERCONNECTION MODULE

FLEXIBLE-SUBSTRATE-BASED THREE-DIMENSIONAL PACKAGING STRUCTURE AND...

Optical communication apparatus and method of assembling the same

METHOD OF MANUFACTURING FAN OUT WAFER LEVEL PACKAGE

HEAT DISSIPATION SOLUTION FOR ADVANCED CHIP PACKAGES

Method for Polishing a Polymer Surface

OBLIQUE ANGLE OPTICAL FIBER ASSEMBLY

Method for Constructing an External Circuit structure

TSV Wafer Thinning Controlling Method and System

METHOD FOR REMOVING ELECTROPLATED METAL FACETS AND REUSING A BARRIE...

Fine Pitch stud POP Structure and Method

Techniques for Fabricating Fine-Pitch Micro-Bumps

TSV Backside Reveal Structure and Exposing Process

TSV Backside Reveal Structure and Exposing Process

Trademarklast 30 trademarks