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Patents Grantslast 30 patents

Information Patent Grant
Wafer-level package having one die with its clock source shared by...
- Patent number 10,261,928
- Issue date Apr 16, 2019
- Nephos (Hefei) Co. Ltd.
- Yi-Hung Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Supporting flow control mechanism of bus between semiconductor dies...
- Patent number 10,127,169
- Issue date Nov 13, 2018
- Nephos (Hefei) Co. Ltd.
- Yao-Chun Su
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wafer-level package having asynchronous FIFO buffer used to deal wi...
- Patent number 10,037,293
- Issue date Jul 31, 2018
- Nephos (Hefei) Co. Ltd.
- Yi-Hung Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
WAFER-LEVEL PACKAGE HAVING ONE DIE WITH ITS CLOCK SOURCE SHARED BY...
- Publication number 20180300272
- Publication date Oct 18, 2018
- Nephos (Hefei) Co. Ltd.
- Yi-Hung Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Trademarklast 30 trademarks