Nexx Systems Packaging, LLC

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Wilmington, MA, US

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Patents Grantslast 30 patents

Information Patent Grant
Substrate processing pallet and related substrate processing method...
- Patent number 6,821,912
- Issue date Nov 23, 2004
- NEXX Systems Packaging, LLC
- Martin P. Klein
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing pallet and related substrate processing method...
- Patent number 6,682,288
- Issue date Jan 27, 2004
- NEXX Systems Packaging, LLC
- Martin P. Klein
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing pallet and related substrate processing method...
- Patent number 6,530,733
- Issue date Mar 11, 2003
- NEXX Systems Packaging, LLC
- Martin P. Klein
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Permanent magnet ECR plasma source with integrated multipolar magne...
- Patent number 6,396,024
- Issue date May 28, 2002
- NEXX Systems Packaging, LLC
- Frank Christian Doughty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer sputter deposition apparatus
- Patent number 6,328,858
- Issue date Dec 11, 2001
- NEXX Systems Packaging, LLC
- David Felsenthal
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

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Patents Applicationslast 30 patents

Information Patent Application
Ultra-thin wafer handling system
- Publication number 20050110291
- Publication date May 26, 2005
- Nexx Systems Packaging, LLC
- Martin P. Klein
- H01 - BASIC ELECTRIC ELEMENTS