Nikko Gould Foil Co., Ltd.

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Surface treatment method of a copper foil for printed circuits
- Patent number 5,456,817
- Issue date Oct 10, 1995
- Nikko Gould Foil Co., Ltd.
- Eiji Hino
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper foil for printed circuits
- Patent number 5,389,446
- Issue date Feb 14, 1995
- Nikko Gould Foil Co., Ltd.
- Keisuke Yamanishi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper foil for printed circuits and process for producing the same
- Patent number 5,366,814
- Issue date Nov 22, 1994
- Nikko Gould Foil Co., Ltd.
- Keisuke Yamanishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing electrolytic copper foil and apparatus for prod...
- Patent number 5,326,455
- Issue date Jul 5, 1994
- Nikko Gould Foil Co., Ltd.
- Toyoshige Kubo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Treatment of copper foil for printed circuits
- Patent number 5,019,222
- Issue date May 28, 1991
- Nikko Gould Foil Co., Ltd.
- Eiji Hino
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

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