Nippon CMK Corp.

Organization

Saitama, JP

Organizations

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Patents Grantslast 30 patents

Information Patent Grant
Printed wiring board having an electromagnetic wave shielding layer
- Patent number 5,416,667
- Issue date May 16, 1995
- Nippon CMK Corp.
- Junichi Ichikawa
- F42 - AMMUNITION BLASTING
Information Patent Grant
Method of manufacturing multilayer printed wiring board
- Patent number 5,404,637
- Issue date Apr 11, 1995
- Nippon CMK Corp.
- Shin Kawakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a printed wiring board having a shield layer
- Patent number 5,308,644
- Issue date May 3, 1994
- Nippon CMK Corp.
- Shin Kawakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing printed wiring board
- Patent number 5,304,392
- Issue date Apr 19, 1994
- Nippon CMK Corp.
- Masuo Matsumoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mold for printed wiring board
- Patent number 5,296,082
- Issue date Mar 22, 1994
- Nippon CMK Corp.
- Isamu Kubo
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Printed wiring board having shielding layer
- Patent number 5,294,755
- Issue date Mar 15, 1994
- Nippon CMK Corp.
- Shin Kawakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board having an electromagnetic shielding layer
- Patent number 5,293,004
- Issue date Mar 8, 1994
- Nippon CMK Corp.
- Shin Kawakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing printed wiring boards having electromagnetic wave shi...
- Patent number 5,291,653
- Issue date Mar 8, 1994
- Nippon CMK Corp.
- Junichi Ichikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing printed wiring board
- Patent number 5,277,787
- Issue date Jan 11, 1994
- Nippon CMK Corp.
- Yasuaki Otani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for masking through holes in manufacturing process of printe...
- Patent number 5,277,929
- Issue date Jan 11, 1994
- Nippon CMK Corp.
- Kameharu Seki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a printed wiring board
- Patent number 5,274,915
- Issue date Jan 4, 1994
- Nippon CMK Corp.
- Yasunori Matsushima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of packing filler into through-holes in a printed circuit board
- Patent number 5,268,194
- Issue date Dec 7, 1993
- Nippon CMK Corp.
- Shin Kawakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 5,268,535
- Issue date Dec 7, 1993
- Nippon CMK Corp.
- Shin Kawakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board having through-holes covered with ink layer an...
- Patent number 5,266,748
- Issue date Nov 30, 1993
- Nippon CMK Corp.
- Shin Kawakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board with through-holes including a test land havi...
- Patent number 5,266,904
- Issue date Nov 30, 1993
- Nippon CMK Corp.
- Masao Akabane
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing printed wiring boards for motors
- Patent number 5,263,240
- Issue date Nov 23, 1993
- Nippon CMK Corp.
- Fumio Nagai
- G01 - MEASURING TESTING
Information Patent Grant
Printed wiring board shielded from electromagnetic wave
- Patent number 5,262,596
- Issue date Nov 16, 1993
- Nippon CMK Corp.
- Shin Kawakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Screen printing method for forming a multiplicity of printed wiring...
- Patent number 5,256,442
- Issue date Oct 26, 1993
- Nippon CMK Corp.
- Shin Kawakami
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Printed wiring board having a connecting terminal
- Patent number 5,250,757
- Issue date Oct 5, 1993
- Nippon CMK Corp.
- Shin Kawakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing printed circuit boards
- Patent number 5,240,737
- Issue date Aug 31, 1993
- Nippon CMK Corp.
- Shin Kawakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hole masking apparatus
- Patent number 5,238,524
- Issue date Aug 24, 1993
- Nippon CMK Corp.
- Kameharu Seki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing an electromagnetic wave shield printed wir...
- Patent number 5,236,736
- Issue date Aug 17, 1993
- Nippon CMK Corp.
- Shin Kawakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming perforations on a printed circuit board
- Patent number 5,233,754
- Issue date Aug 10, 1993
- Nippon CMK Corp.
- Satoshi Matsunaga
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Grant
Method of forming an insulating layer on a printed circuit board
- Patent number 5,234,745
- Issue date Aug 10, 1993
- Nippon CMK Corp.
- Shin Kawakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing printed circuit board
- Patent number 5,219,607
- Issue date Jun 15, 1993
- Nippon CMK Corp.
- Shin Kawakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board having shielding layer
- Patent number 5,220,135
- Issue date Jun 15, 1993
- Nippon CMK Corp.
- Shin Kawakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing a printed circuit board
- Patent number 5,210,940
- Issue date May 18, 1993
- Nippon CMK Corp.
- Shin Kawakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board with electromagnetic wave shielding layer
- Patent number 5,210,379
- Issue date May 11, 1993
- Nippon CMK Corp.
- Hirotaka Okonogi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for inspecting printed circuit boards with through-holes
- Patent number 5,198,778
- Issue date Mar 30, 1993
- Nippon CMK Corp.
- Masao Akabane
- G01 - MEASURING TESTING
Information Patent Grant
Method of manufacturing a printed circuit board
- Patent number 5,195,238
- Issue date Mar 23, 1993
- Nippon CMK Corp.
- Shin Kawakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Trademarklast 30 trademarks

Information Trademark
73751954 - CMK
- Serial number 73751954
- Filing date Sep 14, 1988
- NIPPON CMK CORPORATION
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
73751958 - CMK CORPORATION
- Serial number 73751958
- Filing date Sep 14, 1988
- NIPPON CMK CORPORATION
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
73751956 - CMK
- Serial number 73751956
- Filing date Sep 14, 1988
- NIPPON CMK CORPORATION
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments

Nippon CMK Corp.

Organization

Patents Grantslast 30 patents

Printed wiring board having an electromagnetic wave shielding layer

Method of manufacturing multilayer printed wiring board

Method for manufacturing a printed wiring board having a shield layer

Method of manufacturing printed wiring board

Mold for printed wiring board

Printed wiring board having shielding layer

Printed circuit board having an electromagnetic shielding layer

Manufacturing printed wiring boards having electromagnetic wave shi...

Method of manufacturing printed wiring board

Method for masking through holes in manufacturing process of printe...

Method of manufacturing a printed wiring board

Method of packing filler into through-holes in a printed circuit board

Printed wiring board

Printed wiring board having through-holes covered with ink layer an...

Printed circuit board with through-holes including a test land havi...

Method of manufacturing printed wiring boards for motors

Printed wiring board shielded from electromagnetic wave

Screen printing method for forming a multiplicity of printed wiring...

Printed wiring board having a connecting terminal

Method of manufacturing printed circuit boards

Hole masking apparatus

Method for manufacturing an electromagnetic wave shield printed wir...

Method for forming perforations on a printed circuit board

Method of forming an insulating layer on a printed circuit board

Method of manufacturing printed circuit board

Printed wiring board having shielding layer

Method of producing a printed circuit board

Printed wiring board with electromagnetic wave shielding layer

Method for inspecting printed circuit boards with through-holes

Method of manufacturing a printed circuit board

Patents Applicationslast 30 patents

Trademarklast 30 trademarks

73751954 - CMK

73751958 - CMK CORPORATION

73751956 - CMK